WLCSP-68(3.1x3.2) · 68P预览PinoutFootprint尺寸3DSTM32U375RGY6QTRC45338538ST·WLCSP-68(3.1x3.2)READY68P3.1×3.2×0.48mmP=0.35mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
LQFP-48(7x7) · 48P预览PinoutFootprint尺寸3DSTM32U385CGT6QC45066901ST·LQFP-48(7x7)READY48P7.0×7.0×1.60mmP=0.5mm1.71 V to 3.6 V系列 STM32U385 (7)嵌入式微控制器芯片 (MCU)
UFQFPN-48(7x7) · 49P预览PinoutFootprint尺寸3DSTM32U385CGU6C44847720ST·UFQFPN-48(7x7)READY49P7.0×7.0×0.55mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
WLCSP-52(3.1x3.2) · 52P预览PinoutFootprint尺寸3DSTM32U385CGY6QTRC45338541ST·WLCSP-52(3.1x3.2)READY52P3.1×3.2×0.55mmP=0.39mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-100(7x7) · 100P预览PinoutFootprint尺寸3DSTM32U385VGI6QC44521848ST·UFBGA-100(7x7)READY100P7.0×7.0×0.53mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-64(5x5) · 64P预览PinoutFootprint尺寸3DSTM32U535RBI6QC27164415ST·UFBGA-64(5x5)READY64P5.0×5.0×0.53mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-100(7x7) · 100P预览PinoutFootprint尺寸3DSTM32U535VEI6C27338469ST·UFBGA-100(7x7)READY100P7.0×7.0×0.53mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-100(7x7) · 100P预览PinoutFootprint尺寸3DSTM32U535VEI6QC22406428ST·UFBGA-100(7x7)READY100P7.0×7.0×0.53mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
LQFP-48(7x7) · 48P预览PinoutFootprint尺寸3DSTM32U575CGT6C5271006ST·LQFP-48(7x7)READY48P7.0×7.0×1.60mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-132(7x7) · 132P预览PinoutFootprint尺寸3DSTM32U595QII6QC26125152ST·UFBGA-132(7x7)READY132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
UFBGA-132(7x7) · 132P预览PinoutFootprint尺寸3DSTM32U595QJI6QC22455865ST·UFBGA-132(7x7)READY132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
TFBGA-216(13x13) · 216P预览PinoutFootprint尺寸3DSTM32U5G9NJH6QC22445369ST·TFBGA-216(13x13)READY216P13.0×13.0×1.20mmP=0.8mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
LQFP-100(14x14) · 100P预览PinoutFootprint尺寸3DSTM32U5G9VJT6QC22445370ST·LQFP-100(14x14)READY100P14.0×14.0×1.55mmP=0.5mm1.71 V to 3.6 V嵌入式微控制器芯片 (MCU)
SOT-223 · 4P预览PinoutFootprint尺寸3DAMS1117-3.3C6186Advanced Monolithic Systems·SOT-223READY4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V系列 AMS1117 (2)低压差线性稳压器芯片 (LDO)
SOT-223 · 4P预览PinoutFootprint尺寸3DAMS1117-5.0C6187Advanced Monolithic Systems·SOT-223READY4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V低压差线性稳压器芯片 (LDO)
DIP-8 · 8P预览PinoutFootprint尺寸3DAT24C02CNC7432366HGSEMI·DIP-8READY8P9.6×6.3×4.20mmP=2.54mm1.7V to 5.5V标准电子与连接器元件