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All Packages RF Module BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Components (4084 components · Page 256/256)

Showing 4081–4084 of 4084 components

VQFN-32-EP(5x5) · 8P

ATMEGA88A-MU (VQFN-32-EP(5x5)) - 3D Model (VQFN-32-EP(5x5))

ATMEGA88A-MU

MICROCHIP(美国微芯)·VQFN-32-EP(5x5)

READY

8P

基于AVR增强型RISC架构的低功耗CMOS 8位微控制器

SSOP-28-208mil · 8P

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 3D Model (SSOP-28-208mil)

PIC32MX130F064B-I/SS

MICROCHIP(美国微芯)·SSOP-28-208mil

READY

8P

PIC32MX130F064B-I/SS

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D Model (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D Model (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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