电子元器件目录 — 原理图符号、IPC-7351B 封装焊盘与 3D STEP/GLB (封装 VTLA · 页码 253)

SOT-223 · 4P

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

低压差线性稳压器芯片 (LDO)

0805 · 2P

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

标准电子与连接器元件

LQFN-56(7x7) · 57P

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

嵌入式微控制器芯片 (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

接口转换与时钟定时器芯片

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

SOT-223-3 · 8P

MCP1790-3302E/DB

MICROCHIP(美国微芯)·SOT-223-3

READY

8P

3.3V 70mA 30V

TDFN-8-EP(2x3) · 8P

MCP6072T-E/MNY

MICROCHIP(美国微芯)·TDFN-8-EP(2x3)

READY

8P

低功耗高精度运算放大器

SOT-23-3 · 8P

MCP809T-450I/TT

MICROCHIP(美国微芯)·SOT-23-3

READY

8P

MCP809T-450I/TT

TO-220 · 8P

IRFIZ48NPBF

MICROCHIP(美国微芯)·TO-220

READY

8P

1个N沟道耐压:55V 电流:40A

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

器件库 (4044 款元器件 · 第 253/253)