4006 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4024 Bauteilen · Seite 251/252)

Zeige 4001–4016 von 4024 Bauteilen

SOT-223 · 4P

AMS1117-3.3 (SOT-223) - 3D-Modell (SOT-223)

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

Low-Dropout-Linearspannungsregler (LDO)

0805 · 2P

0805W8F1004T5E (0805) - 3D-Modell (0805)

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

LQFN-56(7x7) · 57P

RP2040 (LQFN-56(7x7)) - 3D-Modell (LQFN-56(7x7))

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

DIP-8 · 8P

NE555P (DIP-8) - 3D-Modell (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

SOT-23-3 · 8P

MCP1700T-3502E/TT (SOT-23-3) - 3D-Modell (SOT-23-3)

MCP1700T-3502E/TT

MICROCHIP(美国微芯)·SOT-23-3

READY

8P

MCP1700T-3502E/TT

SOIC-8 · 8P

25LC080DT-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

25LC080DT-E/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

8Kbit SPI串行EEPROM

SOIC-8 · 8P

25LC080CT-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

25LC080CT-E/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

8Kbit SPI串行EEPROM

TSSOP-8 · 8P

25LC320AX-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

25LC320AX-I/ST

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

25LC320AX I/ST

TSSOP-8 · 8P

AT24CS01-XHM-B (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24CS01-XHM-B

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

I2C兼容串行EEPROM，带唯一128bit 序列号，1Kbit容量

UDFN-8-EP(2x3) · 8P

AT24C32D-MEHM-T (UDFN-8-EP(2x3)) - 3D-Modell (UDFN-8-EP(2x3))

AT24C32D-MEHM-T

MICROCHIP(美国微芯)·UDFN-8-EP(2x3)

READY

8P

32Kbit I²C兼容串行EEPROM

MLF-8 · 8P

MIC5330-JGYML-TR (MLF-8) - 3D-Modell (MLF-8)

MIC5330-JGYML-TR

MICROCHIP(美国微芯)·MLF-8

READY

8P

MIC5330-JGYML-TR

MLF-6 · 8P

MIC5320-SOYMT-TR (MLF-6) - 3D-Modell (MLF-6)

MIC5320-SOYMT-TR

MICROCHIP(美国微芯)·MLF-6

READY

8P

MIC5320-SOYMT-TR

PDIP-8 · 8P

24LC21/P (PDIP-8) - 3D-Modell (PDIP-8)

24LC21/P

MICROCHIP(美国微芯)·PDIP-8

READY

8P

128 x 8bit 串行EEPROM

TSSOP-8 · 8P

93C46B-E/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

93C46B-E/ST

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

1Kbit低电压串行EEPROM

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