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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3733 款元器件 · 第 217/234)

显示 3457–3472 共 3733 款元器件

TSSOP-20 · 20P

STM32G030F6P6TR (TSSOP-20) - 3D模型 (TSSOP-20)

STM32G030F6P6TR

READY

20P6.5×4.4×1.20mmP=0.65mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-48(7x7) · 48P

GD32F103C8T6 (LQFP-48(7x7)) - 3D模型 (LQFP-48(7x7))

GD32F103C8T6

GigaDevice Semicon Beijing·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

标准电子与连接器元件

SOIC-8-208mil · 8P

W25Q64JVSSIQ (SOIC-8-208mil) - 3D模型 (SOIC-8-208mil)

W25Q64JVSSIQ

Winbond·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

标准电子与连接器元件

QFN-28-EP(5x5) · 29P

CP2102N-A02-GQFN28R (QFN-28-EP(5x5)) - 3D模型 (QFN-28-EP(5x5))

CP2102N-A02-GQFN28R

SILICON LABS·QFN-28-EP(5x5)

READY

29P5.0×5.0×0.75mmP=0.5mm

标准电子与连接器元件

LQFP-100(14x14) · 100P

STM32F103VET6 (LQFP-100(14x14)) - 3D模型 (LQFP-100(14x14))

STM32F103VET6

ST·LQFP-100(14x14)

READY

100P13.9×13.9×1.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

SSOP-28-208mil · 28P

FT232RL-REEL (SSOP-28-208mil) - 3D模型 (SSOP-28-208mil)

FT232RL-REEL

FTDI·SSOP-28-208mil

READY

28P10.2×5.3×2.00mmP=0.65mm3.3 - 5.25 V

标准电子与连接器元件

SOIC-18-300mil · 18P

MCP2515-I/SO (SOIC-18-300mil) - 3D模型 (SOIC-18-300mil)

MCP2515-I/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm2.7V – 5.5V

标准电子与连接器元件

SOIC-8 · 8P

SN65HVD230DR (SOIC-8) - 3D模型 (SOIC-8)

SN65HVD230DR

READY

8P4.9×3.9×1.75mmP=1.27mm3 V to 6 V

标准电子与连接器元件

SOT-23-5 · 5P

SY8089AAAC (SOT-23-5) - 3D模型 (SOT-23-5)

SY8089AAAC

Silergy·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.7V to 5.5V

标准电子与连接器元件

SOT-23-6 · 6P

MT3608 (SOT-23-6) - 3D模型 (SOT-23-6)

MT3608

XI'AN Aerosemi Tech·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm2V to 24V

标准电子与连接器元件

ESOP-8 · 9P

TP4056 (ESOP-8) - 3D模型 (ESOP-8)

TP4056

GOODWORK·ESOP-8

READY

9P4.9×3.9×1.70mmP=1.27mm

标准电子与连接器元件

TO-252 · 3P

AOD4184A (TO-252) - 3D模型 (TO-252)

AOD4184A

READY

3P6.5×6.1×2.30mm

标准电子与连接器元件

TO-263-5 · 6P

LM2596S-5.0/NOPB (TO-263-5) - 3D模型 (TO-263-5)

LM2596S-5.0/NOPB

READY

6P10.1×9.0×4.50mmP=1.7mm

标准电子与连接器元件

SOT-223 · 4P

AMS1117-5.0 (SOT-223) - 3D模型 (SOT-223)

AMS1117-5.0

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

低压差线性稳压器芯片 (LDO)

QFN-24-EP(4x4) · 25P

MPU-6050 (QFN-24-EP(4x4)) - 3D模型 (QFN-24-EP(4x4))

MPU-6050

TDK InvenSense·QFN-24-EP(4x4)

READY

25P4.0×4.0×0.90mmP=0.5mm2.375V-3.46V

标准电子与连接器元件

TSSOP-28 · 28P

PCA9685PW,118 (TSSOP-28) - 3D模型 (TSSOP-28)

PCA9685PW,118

READY

28P9.7×4.4×1.00mmP=0.65mm

标准电子与连接器元件

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