4114 PARTSUpload PDF

All Packages RF Module BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Components (1 components · Page 1/1)

Showing 1–1 of 1 components

Through Hole · 3P

H3-B1-1D00S (Through Hole) - 3D Model (Through Hole)

H3-B1-1D00S

Kinghor·Through Hole

READY

3P18.5×8.1×9.50mmP=2.54mm

Standard Electronic & Interconnect Component

Explore Parts Packages MFRs Upload