SMD-41P · 41P预览实物照片3D CADPinoutFootprint尺寸ESP32-S2-SOLO-2U-N4R2ESPRESSIF·SMD-41PREADY41P19.2×18.0×3.20mmP=1.27mm3.0 ~ 3.6 VWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
SOP-16 · 16P预览实物照片3D CADPinoutFootprint尺寸CH340GWCH·SOP-16READY16P9.9×3.9×1.75mmP=1.27mm3.3V to 5V接口转换与时钟定时器芯片
LQFP-48(7x7) · 48P预览实物照片3D CADPinoutFootprint尺寸STM32F103C8T6ST·LQFP-48(7x7)READY48P7.0×7.0×1.60mmP=0.5mm嵌入式微控制器芯片 (MCU)
SOT-223 · 4P预览实物照片3D CADPinoutFootprint尺寸AMS1117-3.3Advanced Monolithic Systems·SOT-223READY4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V低压差线性稳压器芯片 (LDO)
0805 · 2P预览实物照片3D CADPinoutFootprint尺寸0805W8F1004T5EUNI-ROYAL·0805READY2P2.0×1.2×0.50mmP=1.9mm标准电子与连接器元件
LQFN-56(7x7) · 57P预览实物照片3D CADPinoutFootprint尺寸RP2040Raspberry Pi·LQFN-56(7x7)READY57P7.0×7.0×0.90mmP=0.4mm嵌入式微控制器芯片 (MCU)
SMD-38P · 39P预览实物照片3D CADPinoutFootprint尺寸ESP32-WROOM-32E(M113EH6400PH3Q0)ESPRESSIF·SMD-38PREADY39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 VWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
DIP-8 · 8P预览实物照片3D CADPinoutFootprint尺寸NE555PTI·DIP-8READY8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V接口转换与时钟定时器芯片
TQFP-32(7x7) · 32P预览实物照片3D CADPinoutFootprint尺寸ATMEGA328P-AUMICROCHIP·TQFP-32(7x7)READY32P7.0×7.0×1.00mmP=0.8mm嵌入式微控制器芯片 (MCU)
FPBGA-484 · 8P预览实物照片3D CADPinoutFootprint尺寸M1A3PE3000-2FG484IMICROCHIP(美国微芯)·FPBGA-484READY8PM1A3PE3000 2FG484I
FBGA-676 · 8P预览实物照片3D CADPinoutFootprint尺寸AFS1500-2FG676IMICROCHIP(美国微芯)·FBGA-676READY8PAFS1500 2FG676I
CSPBGA-536 · 8P预览实物照片3D CADPinoutFootprint尺寸M2GL150TS-1FCSG536IMICROCHIP(美国微芯)·CSPBGA-536READY8PM2GL150TS 1FCSG536I
FPBGA-256 · 8P预览实物照片3D CADPinoutFootprint尺寸A54SX72A-FFGG256MICROCHIP(美国微芯)·FPBGA-256READY8PA54SX72A-FFGG256
FPBGA-144 · 8P预览实物照片3D CADPinoutFootprint尺寸APA300-FG144IMICROCHIP(美国微芯)·FPBGA-144READY8PAPA300 FG144I
FPBGA-256 · 8P预览实物照片3D CADPinoutFootprint尺寸M1AGL600V5-FGG256MICROCHIP(美国微芯)·FPBGA-256READY8PM1AGL600V5-FGG256