4070 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4084 款元器件 · 第 235/256)

显示 3745–3760 共 4084 款元器件

Through Hole,Right Angle,P=2mm · 10P

HX PM2.0-2x5P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x5P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

10P10.4×6.4×6.35mmP=2mm

标准电子与连接器元件

Through Hole · 3P

H3-B1-1D00S (Through Hole) - 3D模型 (Through Hole)

H3-B1-1D00S

Kinghor·Through Hole

READY

3P18.5×8.1×9.50mmP=2.54mm

标准电子与连接器元件

Through Hole,Right Angle,P=2mm · 14P

HX PM2.0-2x7P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x7P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

14P14.4×6.4×6.35mmP=2mm

标准电子与连接器元件

Through Hole,Right Angle,P=2mm · 6P

HX PM2.0-1x6P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x6P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

6P12.4×6.4×6.35mmP=2mm

标准电子与连接器元件

Through Hole,Right Angle,P=2mm · 7P

HX PM2.0-1x7P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x7P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

7P14.4×6.4×6.35mmP=2mm

标准电子与连接器元件

Through Hole,7.5x4.7mm · 4P

HX-ESE24SH1-WC HB (Through Hole,7.5x4.7mm) - 3D模型 (Through Hole,7.5x4.7mm)

HX-ESE24SH1-WC HB

hanxia·Through Hole,7.5x4.7mm

READY

4P7.9×8.6×4.20mm

标准电子与连接器元件

SMD-41P · 41P

ESP32-S2-SOLO-2-N4R2 (SMD-41P) - 3D模型 (SMD-41P)

ESP32-S2-SOLO-2-N4R2

ESPRESSIF·SMD-41P

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-38P · 39P

ESP32-WROOM-32E (4MB HIGH TEMP) (SMD-38P) - 3D模型 (SMD-38P)

ESP32-WROOM-32E (4MB HIGH TEMP)

ESPRESSIF(乐鑫)·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,16.6x13.2mm · 53P

ESP8684-MINI-1-H2X (SMD,16.6x13.2mm) - 3D模型 (SMD,16.6x13.2mm)

ESP8684-MINI-1-H2X

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,13.2x12.5mm · 61P

ESP8684-MINI-1U-H4 (SMD,13.2x12.5mm) - 3D模型 (SMD,13.2x12.5mm)

ESP8684-MINI-1U-H4

ESPRESSIF·SMD,13.2x12.5mm

READY

61P13.2×12.5×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,16.6x13.2mm · 53P

ESP32-C3-MINI-1-H4 (SMD,16.6x13.2mm) - 3D模型 (SMD,16.6x13.2mm)

ESP32-C3-MINI-1-H4

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,16.6x13.2mm · 53P

ESP32-C6-MINI-1-H8 (SMD,16.6x13.2mm) - 3D模型 (SMD,16.6x13.2mm)

ESP32-C6-MINI-1-H8

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,16.6x13.2mm · 53P

ESP32-C6-MINI-1-H4 (SMD,16.6x13.2mm) - 3D模型 (SMD,16.6x13.2mm)

ESP32-C6-MINI-1-H4

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N16R2 (SMD,25.5x18mm) - 3D模型 (SMD,25.5x18mm)

ESP32-S3-WROOM-1-N16R2

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,25.5x18mm · 41P

ESP32-S3-WROOM-1-N8 (SMD,25.5x18mm) - 3D模型 (SMD,25.5x18mm)

ESP32-S3-WROOM-1-N8

ESPRESSIF·SMD,25.5x18mm

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,13.2x12.5mm · 61P

ESP32-C3-MINI-1U-N4 (SMD,13.2x12.5mm) - 3D模型 (SMD,13.2x12.5mm)

ESP32-C3-MINI-1U-N4

ESPRESSIF·SMD,13.2x12.5mm

READY

61P13.2×12.5×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

探索器件库封装厂商上传