SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL · 8P预览实物照片3D CADPinoutFootprint尺寸C23069945Generic·SOIC-8_L4.9-W3.9-P1.27-LS6.0-BLREADY8P4.9×3.9×1.75mmP=1.27mm标准电子与连接器元件
DIP-8 · 8P预览实物照片3D CADPinoutFootprint尺寸DS1307ZN-778/HGHGSEMI·DIP-8READY8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V标准电子与连接器元件
TSSOP-20 · 20P预览实物照片3D CADPinoutFootprint尺寸STM32G030F6P6TRST·TSSOP-20READY20P6.5×4.4×1.20mmP=0.65mm2.0 V to 3.6 V嵌入式微控制器芯片 (MCU)
LQFP-48(7x7) · 48P预览实物照片3D CADPinoutFootprint尺寸GD32F103C8T6GigaDevice Semicon Beijing·LQFP-48(7x7)READY48P7.0×7.0×1.60mmP=0.5mm标准电子与连接器元件
SOIC-8-208mil · 8P预览实物照片3D CADPinoutFootprint尺寸W25Q64JVSSIQWinbond·SOIC-8-208milREADY8P5.3×5.3×1.90mmP=1.27mm标准电子与连接器元件
QFN-28-EP(5x5) · 29P预览实物照片3D CADPinoutFootprint尺寸CP2102N-A02-GQFN28RSILICON LABS·QFN-28-EP(5x5)READY29P5.0×5.0×0.75mmP=0.5mm标准电子与连接器元件
LQFP-100(14x14) · 100P预览实物照片3D CADPinoutFootprint尺寸STM32F103VET6ST·LQFP-100(14x14)READY100P13.9×13.9×1.60mmP=0.5mm嵌入式微控制器芯片 (MCU)
SSOP-28-208mil · 28P预览实物照片3D CADPinoutFootprint尺寸FT232RL-REELFTDI·SSOP-28-208milREADY28P10.2×5.3×2.00mmP=0.65mm3.3 - 5.25 V标准电子与连接器元件
SOIC-18-300mil · 18P预览实物照片3D CADPinoutFootprint尺寸MCP2515-I/SOMICROCHIP·SOIC-18-300milREADY18P11.6×7.5×2.70mmP=1.27mm2.7V – 5.5V标准电子与连接器元件
SOIC-8 · 8P预览实物照片3D CADPinoutFootprint尺寸SN65HVD230DRTI·SOIC-8READY8P4.9×3.9×1.75mmP=1.27mm3 V to 6 V标准电子与连接器元件
SOT-23-5 · 5P预览实物照片3D CADPinoutFootprint尺寸SY8089AAACSilergy·SOT-23-5READY5P2.9×1.6×1.10mmP=0.95mm2.7V to 5.5V标准电子与连接器元件
SOT-23-6 · 6P预览实物照片3D CADPinoutFootprint尺寸MT3608XI'AN Aerosemi Tech·SOT-23-6READY6P2.9×1.6×1.10mmP=0.95mm2V to 24V标准电子与连接器元件
TO-263-5 · 6P预览实物照片3D CADPinoutFootprint尺寸LM2596S-5.0/NOPBTI·TO-263-5READY6P10.1×9.0×4.50mmP=1.7mm标准电子与连接器元件
SOT-223 · 4P预览实物照片3D CADPinoutFootprint尺寸AMS1117-5.0Advanced Monolithic Systems·SOT-223READY4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V系列 AMS1117 (2)低压差线性稳压器芯片 (LDO)