2284 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3566 款元器件 · 第 169/223)

显示 2689–2704 共 3566 款元器件

LFLGA-86 · 86P

STM32WB5MMGH6TR (LFLGA-86) - 3D模型 (LFLGA-86)

STM32WB5MMGH6TR

READY

86P11.0×7.3×1.15mmP=0.45mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265(14x14) · 265P

STM32H747XIH6 (TFBGA-265(14x14)) - 3D模型 (TFBGA-265(14x14))

STM32H747XIH6

ST·TFBGA-265(14x14)

READY

265P14.0×14.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H725IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H725IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm1.62 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H750XBH6U (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H750XBH6U

READY

265P14.0×14.0×1.03mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-143 · 143P

STM32F746ZGY6TR (UFBGA-143) - 3D模型 (UFBGA-143)

STM32F746ZGY6TR

READY

143P5.8×4.5×0.55mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H745XIH3 (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H745XIH3

READY

265P14.0×14.0×1.03mmP=0.8mm

嵌入式微控制器芯片 (MCU)

TFBGA-361 · 361P

STM32MP157DAC1 (TFBGA-361) - 3D模型 (TFBGA-361)

STM32MP157DAC1

READY

361P12.0×12.0×0.96mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F103VBI6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F103VBI6

READY

100P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

WLCSP-66(3.8x4.2) · 66P

STM32F383RCY6TR (WLCSP-66(3.8x4.2)) - 3D模型 (WLCSP-66(3.8x4.2))

STM32F383RCY6TR

ST·WLCSP-66(3.8x4.2)

READY

66P4.2×3.8×0.57mmP=0.4mm

嵌入式微控制器芯片 (MCU)

WLCSP-25(2.3x2.5) · 25P

STM32G081EBY6TR (WLCSP-25(2.3x2.5)) - 3D模型 (WLCSP-25(2.3x2.5))

STM32G081EBY6TR

ST·WLCSP-25(2.3x2.5)

READY

25P2.5×2.3×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U585QII6Q (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U585QII6Q

ST·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LFBGA-354 · 354P

STM32MP151AAB3 (LFBGA-354) - 3D模型 (LFBGA-354)

STM32MP151AAB3

READY

354P16.0×16.0×1.35mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-257 · 257P

STM32MP157CAD3 (TFBGA-257) - 3D模型 (TFBGA-257)

STM32MP157CAD3

READY

257P10.0×10.0×1.20mmP=0.65mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H7B3IIK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H7B3IIK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H742IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H742IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

BGA-176(10x10) · 201P

STM32H7A3IIK6 (BGA-176(10x10)) - 3D模型 (BGA-176(10x10))

STM32H7A3IIK6

ST·BGA-176(10x10)

READY

201P10.0×10.0×1.35mmP=0.65mm

嵌入式微控制器芯片 (MCU)

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