3834 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3844 Bauteilen · Seite 1/241)

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QFN-48-EP(7x7) · 49P

KSZ9031RNXCA-TR (QFN-48-EP(7x7)) - 3D-Modell (QFN-48-EP(7x7))

KSZ9031RNXCA-TR

MICROCHIP·QFN-48-EP(7x7)

READY

49P7.0×7.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC384-3BM (SOIC-8) - 3D-Modell (SOIC-8)

MIC384-3BM

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

SY100ELT25ZC (SOIC-8) - 3D-Modell (SOIC-8)

SY100ELT25ZC

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm1.0V to 2.0V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-14 · 14P

MIC2042-1BTS-TR (TSSOP-14) - 3D-Modell (TSSOP-14)

MIC2042-1BTS-TR

MICROCHIP·TSSOP-14

READY

14P5.0×4.4×1.00mmP=0.65mm8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

VFBGA-400 · 400P

M2GL025-VFG400 (VFBGA-400) - 3D-Modell (VFBGA-400)

M2GL025-VFG400

MICROCHIP·VFBGA-400

READY

400P17.0×17.0×0.85mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(9x9) · 65P

DSPIC33CK128MC506-I/MR (QFN-64(9x9)) - 3D-Modell (QFN-64(9x9))

DSPIC33CK128MC506-I/MR

MICROCHIP·QFN-64(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

- · 101P

ZL30291LDG1 (-) - 3D-Modell (-)

ZL30291LDG1

READY

101P8.0×8.0×0.60mmP=0.35mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-44(16.6x16.6) · 44P

AT27C4096-15JI (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

AT27C4096-15JI

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

MLF-6(1.6x1.6) · 7P

MIC5335-PMYMT (MLF-6(1.6x1.6)) - 3D-Modell (MLF-6(1.6x1.6))

MIC5335-PMYMT

MICROCHIP·MLF-6(1.6x1.6)

READY

7P1.6×1.6×0.75mmP=0.51mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

- · 7P

MIC5335-SOYMT (-) - 3D-Modell (-)

MIC5335-SOYMT

READY

7P1.6×1.6×0.75mmP=0.51mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MLF-10(3x3) · 11P

MIC2214-PMBML (MLF-10(3x3)) - 3D-Modell (MLF-10(3x3))

MIC2214-PMBML

MICROCHIP·MLF-10(3x3)

READY

11P3.0×3.0×1.00mmP=0.5mm2.25V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY100H641LJC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY100H641LJC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm1.0V to 2.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16LF1773T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16LF1773T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

dsPIC33FJ128GP802T-I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

dsPIC33FJ128GP802T-I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.90mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOP-8-208mil · 8P

PIC12LC508AT-04/SM (SOP-8-208mil) - 3D-Modell (SOP-8-208mil)

PIC12LC508AT-04/SM

MICROCHIP·SOP-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOP-8-208mil · 8P

PIC12C509AT-04E/SM (SOP-8-208mil) - 3D-Modell (SOP-8-208mil)

PIC12C509AT-04E/SM

MICROCHIP·SOP-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

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