3911 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3924 Bauteilen · Seite 95/246)

Zeige 1505–1520 von 3924 Bauteilen

SMD3225-6P · 6P

DSC1203CI2-100M0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1203CI2-100M0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144-250I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144-250I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-128 · 128P

MEC1428-TF-C1 (WFBGA-128) - 3D-Modell (WFBGA-128)

MEC1428-TF-C1

MICROCHIP·WFBGA-128

READY

128P7.0×7.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LLGA-26(6x6) · 26P

HV230B1-G (LLGA-26(6x6)) - 3D-Modell (LLGA-26(6x6))

HV230B1-G

MICROCHIP·LLGA-26(6x6)

READY

26P6.0×6.0×1.15mmP=0.65mm4.5V to 13.2V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-120 · 120P

ATSAMD51P20A-CTFT (TFBGA-120) - 3D-Modell (TFBGA-120)

ATSAMD51P20A-CTFT

MICROCHIP·TFBGA-120

READY

120P8.0×8.0×1.12mmP=0.5mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6003HI1A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6003HI1A-000.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C2650839 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C2650839

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

- · 44P

RN131G-I/RM (-) - 3D-Modell (-)

RN131G-I/RM

READY

44P37.0×20.0×3.10mmP=2mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

PBGA-272 · 272P

A42MX36-2BG272I (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-2BG272I

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-1BG272I (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-1BG272I

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-2BGG272I (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-2BGG272I

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-BG272I (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-BG272I

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-672(27x27) · 672P

LFCPNX-100-7LFG672I (FCBGA-672(27x27)) - 3D-Modell (FCBGA-672(27x27))

LFCPNX-100-7LFG672I

Lattice·FCBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

SMD-36P · 37P

ATWINC3400-MR210UA142 (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210UA142

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-28P · 29P

ATWINC1510-MR210PB1976 (SMD-28P) - 3D-Modell (SMD-28P)

ATWINC1510-MR210PB1976

MICROCHIP·SMD-28P

READY

29P21.8×14.8×2.40mmP=1.02mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFBGA-88(6x6) · 88P

ATMXT640UD-CCUBHA1 (UFBGA-88(6x6)) - 3D-Modell (UFBGA-88(6x6))

ATMXT640UD-CCUBHA1

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

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