3962 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3964 Bauteilen · Seite 95/248)

Zeige 1505–1520 von 3964 Bauteilen

SMD-36P · 37P

ATWINC3400-MR210CA122-T (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210CA122-T

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

TFBGA-144 · 144P

PIC32MZ1024EFG144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFG144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39LF801C-55-4C-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39LF801C-55-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF400B-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF400B-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1103CE2-135.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1103CE2-135.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

UFBGA-100 · 100P

ATSAML22N18A-CFUT (UFBGA-100) - 3D-Modell (UFBGA-100)

ATSAML22N18A-CFUT

MICROCHIP·UFBGA-100

READY

100P6.0×6.0×0.58mmP=0.5mm1.62V – 3.63V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF800B-70-4C-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF800B-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-36P · 37P

ATWINC3400-MR210UA122 (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210UA122

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-35P · 36P

RN42-I/RM (SMD-35P) - 3D-Modell (SMD-35P)

RN42-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

WIRELM-SMD_MICROCHIP_ATWINC15X0 · 29P

C1526199 (WIRELM-SMD_MICROCHIP_ATWINC15X0) - 3D-Modell (WIRELM-SMD_MICROCHIP_ATWINC15X0)

C1526199

Generic·WIRELM-SMD_MICROCHIP_ATWINC15X0

READY

29P21.8×14.8×2.40mmP=1.02mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFBGA-100 · 100P

ATSAML22N16A-CFUT (UFBGA-100) - 3D-Modell (UFBGA-100)

ATSAML22N16A-CFUT

MICROCHIP·UFBGA-100

READY

100P6.0×6.0×0.58mmP=0.5mm1.62V – 3.63V

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-888(25x25) · 888P

VSC7556-V/5CC (FCBGA-888(25x25)) - 3D-Modell (FCBGA-888(25x25))

VSC7556-V/5CC

MICROCHIP·FCBGA-888(25x25)

READY

888P25.0×25.0×1.35mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6023HI2A-00A7T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6023HI2A-00A7T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

LFBGA-288 · 288P

PIC32MZ2064DAA288T-I/4J (LFBGA-288) - 3D-Modell (LFBGA-288)

PIC32MZ2064DAA288T-I/4J

MICROCHIP·LFBGA-288

READY

288P15.0×15.0×1.45mmP=0.8mm2.2V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

BGA-247 · 247P

AT91SAM9G25-CFU (BGA-247) - 3D-Modell (BGA-247)

AT91SAM9G25-CFU

MICROCHIP·BGA-247

READY

247P10.0×10.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

BGA-247 · 247P

AT91SAM9CN12B-CFU (BGA-247) - 3D-Modell (BGA-247)

AT91SAM9CN12B-CFU

MICROCHIP·BGA-247

READY

247P10.0×10.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

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