4078 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4084 Bauteilen · Seite 88/256)

Zeige 1393–1408 von 4084 Bauteilen

- · 24P

CRT9006-83HSBIP (-) - 3D-Modell (-)

CRT9006-83HSBIP

READY

24P29.9×13.7×4.20mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL · 8P

C144181 (SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL) - 3D-Modell (SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL)

C144181

Generic·SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

- · 5P

MIC29512BT L3 (-) - 3D-Modell (-)

MIC29512BT L3

READY

5P10.2×4.2×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT24C08A-10PC (PDIP-8) - 3D-Modell (PDIP-8)

AT24C08A-10PC

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.50mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT24C16N-10SC-2.5 (SOIC-8) - 3D-Modell (SOIC-8)

AT24C16N-10SC-2.5

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC4420ZM (SOIC-8) - 3D-Modell (SOIC-8)

MIC4420ZM

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm4.5V to 18V

Standard-Elektronik- & Steckverbinderbauteil

DIP-28 · 28P

MCP23S17-E/SP (DIP-28) - 3D-Modell (DIP-28)

MCP23S17-E/SP

MICROCHIP·DIP-28

READY

28P34.6×7.3×4.20mmP=2.54mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC2042-1YM (SOIC-8) - 3D-Modell (SOIC-8)

MIC2042-1YM

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-14 · 14P

PIC16LF18326-E/ST (TSSOP-14) - 3D-Modell (TSSOP-14)

PIC16LF18326-E/ST

MICROCHIP·TSSOP-14

READY

14P5.0×4.4×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

FBGA-896(31x31) · 896P

M2GL050-FG896 (FBGA-896(31x31)) - 3D-Modell (FBGA-896(31x31))

M2GL050-FG896

MICROCHIP·FBGA-896(31x31)

READY

896P31.0×31.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-1152(35x35) · 1152P

MPFS250T-1FCG1152E (FCBGA-1152(35x35)) - 3D-Modell (FCBGA-1152(35x35))

MPFS250T-1FCG1152E

MICROCHIP·FCBGA-1152(35x35)

READY

1152P35.0×35.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-784(29x29) · 784P

MPF200TL-FCG784E (FCBGA-784(29x29)) - 3D-Modell (FCBGA-784(29x29))

MPF200TL-FCG784E

MICROCHIP·FCBGA-784(29x29)

READY

784P29.0×29.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-484(23x23) · 484P

M2GL005-1FG484 (FPBGA-484(23x23)) - 3D-Modell (FPBGA-484(23x23))

M2GL005-1FG484

MICROCHIP·FPBGA-484(23x23)

READY

484P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

CSPBGA-536(16x16) · 536P

MPF300T-FCSG536E (CSPBGA-536(16x16)) - 3D-Modell (CSPBGA-536(16x16))

MPF300T-FCSG536E

MICROCHIP·CSPBGA-536(16x16)

READY

536P16.0×16.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

MIC5162BMM-TR (MSOP-10) - 3D-Modell (MSOP-10)

MIC5162BMM-TR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16F18044-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16F18044-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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