3806 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3824 Bauteilen · Seite 85/239)

Zeige 1345–1360 von 3824 Bauteilen

UFBGA-136(7x7) · 136P

ATMXT1664T3-CCUR035 (UFBGA-136(7x7)) - 3D-Modell (UFBGA-136(7x7))

ATMXT1664T3-CCUR035

MICROCHIP·UFBGA-136(7x7)

READY

136P7.0×7.0×0.60mmP=0.5mm1.8V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

UFBGA-88(6x6) · 88P

ATMXT640UD-CCU001 (UFBGA-88(6x6)) - 3D-Modell (UFBGA-88(6x6))

ATMXT640UD-CCU001

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128595 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D-Modell (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128595

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(7x7) · 65P

ATMEGA169PV-8MCH (QFN-64(7x7)) - 3D-Modell (QFN-64(7x7))

ATMEGA169PV-8MCH

MICROCHIP·QFN-64(7x7)

READY

65P7.0×7.0×1.35mmP=0.65mm1.8V - 5.5V

Eingebetteter Mikrocontroller (MCU)

SMD-36P · 37P

ATWINC3400-MR210CA122-T (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210CA122-T

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

TFBGA-144 · 144P

PIC32MZ1024EFG144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFG144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39LF801C-55-4C-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39LF801C-55-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF400B-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF400B-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1103CE2-135.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1103CE2-135.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

UFBGA-100 · 100P

ATSAML22N18A-CFUT (UFBGA-100) - 3D-Modell (UFBGA-100)

ATSAML22N18A-CFUT

MICROCHIP·UFBGA-100

READY

100P6.0×6.0×0.58mmP=0.5mm1.62V – 3.63V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF800B-70-4C-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF800B-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-36P · 37P

ATWINC3400-MR210UA122 (SMD-36P) - 3D-Modell (SMD-36P)

ATWINC3400-MR210UA122

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-35P · 36P

RN42-I/RM (SMD-35P) - 3D-Modell (SMD-35P)

RN42-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.4×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

WIRELM-SMD_MICROCHIP_ATWINC15X0 · 29P

C1526199 (WIRELM-SMD_MICROCHIP_ATWINC15X0) - 3D-Modell (WIRELM-SMD_MICROCHIP_ATWINC15X0)

C1526199

Generic·WIRELM-SMD_MICROCHIP_ATWINC15X0

READY

29P21.8×14.8×2.40mmP=1.02mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

UFBGA-100 · 100P

ATSAML22N16A-CFUT (UFBGA-100) - 3D-Modell (UFBGA-100)

ATSAML22N16A-CFUT

MICROCHIP·UFBGA-100

READY

100P6.0×6.0×0.58mmP=0.5mm1.62V – 3.63V

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-888(25x25) · 888P

VSC7556-V/5CC (FCBGA-888(25x25)) - 3D-Modell (FCBGA-888(25x25))

VSC7556-V/5CC

MICROCHIP·FCBGA-888(25x25)

READY

888P25.0×25.0×1.35mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

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