4066 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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QFN-28-EP(6x6) · 29P

PIC24F16KL402-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F16KL402-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PQFP-44(10x10) · 44P

HV5622PG-G (PQFP-44(10x10)) - 3D-Modell (PQFP-44(10x10))

HV5622PG-G

MICROCHIP·PQFP-44(10x10)

READY

44P10.0×10.0×2.20mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

SMD · 12P

MRF89XAM9A-I/RM (SMD) - 3D-Modell (SMD)

MRF89XAM9A-I/RM

READY

12P28.2×19.8×3.10mm2.1–3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

PDIP-40 · 40P

PIC16F871-I/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC16F871-I/P

MICROCHIP·PDIP-40

READY

40P50.3×13.7×4.20mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC32MX274F256BT-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.5V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64-EP(9x9) · 65P

PIC32MX664F128H-I/MR (QFN-64-EP(9x9)) - 3D-Modell (QFN-64-EP(9x9))

PIC32MX664F128H-I/MR

MICROCHIP·QFN-64-EP(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SO-8 · 8P

MIC29204YM (SO-8) - 3D-Modell (SO-8)

MIC29204YM

MICROCHIP·SO-8

READY

8P5.0×3.9×1.75mmP=1.27mm1.24V to 26V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC24HJ32GP304-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC24HJ32GP304-I/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.00mmP=0.8mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SPDIP-28 · 28P

PIC24HJ128GP502-I/SP (SPDIP-28) - 3D-Modell (SPDIP-28)

PIC24HJ128GP502-I/SP

MICROCHIP·SPDIP-28

READY

28P34.7×7.2×2.00mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

MIC2178YWM (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

MIC2178YWM

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm4.5V to 16.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-32-EP(5x5) · 33P

SY89853UMG (QFN-32-EP(5x5)) - 3D-Modell (QFN-32-EP(5x5))

SY89853UMG

MICROCHIP·QFN-32-EP(5x5)

READY

33P5.0×5.0×1.00mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC24F32KA301-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC24F32KA301-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×2.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-64(10x10) · 64P

PIC24EP512GP806-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC24EP512GP806-I/PT

MICROCHIP·TQFP-64(10x10)

READY

64P10.0×10.0×1.20mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC18F2580-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC18F2580-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.85mmP=0.65mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C020-55JU (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C020-55JU

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-18-300mil · 18P

PIC18F1320-I/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

PIC18F1320-I/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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