3998 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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QFN-44-EP(8x8) · 45P

PIC24FJ64GB004-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC24FJ64GB004-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm2.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18F23K22-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F23K22-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24F32KA302-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F32KA302-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WLCSP-49(2.8x2.8) · 49P

ATSAMG55G19B-UUT (WLCSP-49(2.8x2.8)) - 3D-Modell (WLCSP-49(2.8x2.8))

ATSAMG55G19B-UUT

MICROCHIP·WLCSP-49(2.8x2.8)

READY

49P2.8×2.8×0.50mmP=0.4mm1.62V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-44(16.6x16.6) · 44P

PIC16F877-20I/L (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

PIC16F877-20I/L

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.15mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY10E107JC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY10E107JC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY100S301JC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY100S301JC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F689-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F689-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm2.0V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC16F74-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC16F74-I/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.20mmP=0.8mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

LFBGA-217 · 217P

AT91SAM9G20B-CU (LFBGA-217) - 3D-Modell (LFBGA-217)

AT91SAM9G20B-CU

MICROCHIP·LFBGA-217

READY

217P15.0×15.0×1.10mmP=0.8mm9V to 1.1V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F631-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F631-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm2.0V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-144(13x13) · 144P

A3P250-1FGG144 (FPBGA-144(13x13)) - 3D-Modell (FPBGA-144(13x13))

A3P250-1FGG144

MICROCHIP·FPBGA-144(13x13)

READY

144P13.0×13.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

PIC12F617-I/SN (SOIC-8) - 3D-Modell (SOIC-8)

PIC12F617-I/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP1703AT-5002E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP1703AT-5002E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm2.7V to16.0V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP6241-E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP6241-E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MIC5206-3.3YM5-TR (SOT-23-5) - 3D-Modell (SOT-23-5)

MIC5206-3.3YM5-TR

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm1V to 16V

Standard-Elektronik- & Steckverbinderbauteil

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