3965 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3984 Bauteilen · Seite 72/249)

Zeige 1137–1152 von 3984 Bauteilen

FPBGA-484 · 484P

A3P1000-1FGG484T (FPBGA-484) - 3D-Modell (FPBGA-484)

A3P1000-1FGG484T

MICROCHIP·FPBGA-484

READY

484P23.0×23.0×1.35mmP=1mm3 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-484 · 484P

A3PE1500-FG484 (FPBGA-484) - 3D-Modell (FPBGA-484)

A3PE1500-FG484

MICROCHIP·FPBGA-484

READY

484P23.0×23.0×1.35mmP=1mm3 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(17x17) · 256P

A54SX72A-FG256 (FPBGA-256(17x17)) - 3D-Modell (FPBGA-256(17x17))

A54SX72A-FG256

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

SOP-8 · 8P

MIC2525-2BM TR (SOP-8) - 3D-Modell (SOP-8)

MIC2525-2BM TR

MICROCHIP·SOP-8

READY

8P4.9×3.9×1.75mmP=1.27mm4.50V to 5.25V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-18-300mil · 18P

PIC16C620A-04/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

PIC16C620A-04/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24F16KA102-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F16KA102-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-64(10x10) · 64P

PIC16F19195T-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC16F19195T-I/PT

MICROCHIP·TQFP-64(10x10)

READY

64P10.0×10.0×1.20mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC18LF47K40-E/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC18LF47K40-E/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.20mmP=0.8mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC16F777-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC16F777-I/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.20mmP=0.8mm2.7V-3.3V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-28-208mil · 28P

PIC18F24K20-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC18F24K20-I/SS

MICROCHIP·SSOP-28-208mil

READY

28P10.2×5.3×2.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TO-220 · 3P

MIC29150-5.0WT (TO-220) - 3D-Modell (TO-220)

MIC29150-5.0WT

MICROCHIP·TO-220

READY

3P10.0×4.5×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-14 · 14P

ATTINY24-20SSU (SOIC-14) - 3D-Modell (SOIC-14)

ATTINY24-20SSU

MICROCHIP·SOIC-14

READY

14P8.7×3.9×1.75mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64-EP(9x9) · 65P

PIC16F1947-I/MR (QFN-64-EP(9x9)) - 3D-Modell (QFN-64-EP(9x9))

PIC16F1947-I/MR

MICROCHIP·QFN-64-EP(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIJ-8-5.28mm · 8P

24C65-I/SM (SOIJ-8-5.28mm) - 3D-Modell (SOIJ-8-5.28mm)

24C65-I/SM

MICROCHIP·SOIJ-8-5.28mm

READY

8P5.3×5.3×1.00mmP=1.27mm1.8V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

DSPIC33FJ128GP802-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

DSPIC33FJ128GP802-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-64(10x10) · 64P

ENC624J600-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

ENC624J600-I/PT

MICROCHIP·TQFP-64(10x10)

READY

64P10.0×10.0×1.20mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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