2284 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3632 Bauteilen · Seite 70/227)

Zeige 1105–1120 von 3632 Bauteilen

WFBGA-48(4x6) · 48P

SST39VF200A-70-4C-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF200A-70-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39VF401C-70-4C-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF401C-70-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39VF1601C-70-4I-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF1601C-70-4I-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(7x7) · 65P

ATMEGA169PA-MCH (QFN-64(7x7)) - 3D-Modell (QFN-64(7x7))

ATMEGA169PA-MCH

MICROCHIP·QFN-64(7x7)

READY

65P7.0×7.0×1.35mmP=0.65mm

Eingebetteter Mikrocontroller (MCU)

LFBGA-217 · 217P

AT91SAM9XE256-CU (LFBGA-217) - 3D-Modell (LFBGA-217)

AT91SAM9XE256-CU

MICROCHIP·LFBGA-217

READY

217P15.0×15.0×1.35mmP=0.8mm1.65V to 1.95V

Standard-Elektronik- & Steckverbinderbauteil

UDFN-6(2x2) · 7P

NCP380HMU05AATBG (UDFN-6(2x2)) - 3D-Modell (UDFN-6(2x2))

NCP380HMU05AATBG

onsemi·UDFN-6(2x2)

READY

7P2.0×2.0×0.85mmP=0.65mm2.5 V – 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA · 48P

MX29LV160DBXBI-70GTR (TFBGA) - 3D-Modell (TFBGA)

MX29LV160DBXBI-70GTR

READY

48P4.0×6.0×1.12mmP=0.5mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6023HI2A-00A5 (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6023HI2A-00A5

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD7050-4P · 5P

DSC1001AL5-040.0000T (SMD7050-4P) - 3D-Modell (SMD7050-4P)

DSC1001AL5-040.0000T

MICROCHIP·SMD7050-4P

READY

5P7.0×5.0×2.00mm1.8 to 3.3 v

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6111HE1A-PROGRAMMABLE (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6111HE1A-PROGRAMMABLE

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ0512EFF144-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ0512EFF144-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-64 · 64P

SCH3223-7U (WFBGA-64) - 3D-Modell (WFBGA-64)

SCH3223-7U

MICROCHIP·WFBGA-64

READY

64P6.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LFBGA-288 · 288P

PIC32MZ2025DAB288-I/4J (LFBGA-288) - 3D-Modell (LFBGA-288)

PIC32MZ2025DAB288-I/4J

MICROCHIP·LFBGA-288

READY

288P15.0×15.0×1.45mmP=0.8mm2.2V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SMD-37P · 37P

MRF24WN0MB-I/RM100 (SMD-37P) - 3D-Modell (SMD-37P)

MRF24WN0MB-I/RM100

MICROCHIP·SMD-37P

READY

37P26.7×17.8×3.10mmP=1.27mm3.15V to 3.45V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

CPGA-28(14x16.5) · 28P

AT28C256-15UM/883-815 (CPGA-28(14x16.5)) - 3D-Modell (CPGA-28(14x16.5))

AT28C256-15UM/883-815

MICROCHIP·CPGA-28(14x16.5)

READY

28P15.2×13.7×3.68mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-672 · 672P

LFE3-35EA-8FN672I (FPBGA-672) - 3D-Modell (FPBGA-672)

LFE3-35EA-8FN672I

Lattice·FPBGA-672

READY

672P27.0×27.0×1.35mmP=1mm5 V to 1.32 V

Standard-Elektronik- & Steckverbinderbauteil

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