4026 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4044 Bauteilen · Seite 5/253)

Zeige 65–80 von 4044 Bauteilen

SOIC-28 · 28P

AT27C256R-45RI (SOIC-28) - 3D-Modell (SOIC-28)

AT27C256R-45RI

MICROCHIP·SOIC-28

READY

28P18.3×8.6×2.50mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-15JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-15JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-90JC (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-90JC

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27C256R-45TU (TSOP-28) - 3D-Modell (TSOP-28)

AT27C256R-45TU

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-32(11.4x14) · 32P

AT27C256R-70JI (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C256R-70JI

MICROCHIP·PLCC-32(11.4x14)

READY

32P14.0×11.4×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

0402 · 2P

MPP4205-206/TR (0402) - 3D-Modell (0402)

MPP4205-206/TR

MICROCHIP·0402

READY

2P1.0×0.5×0.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16F873-04/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16F873-04/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

UQFN-40-EP(5x5) · 41P

PIC18LF47K40-E/MV (UQFN-40-EP(5x5)) - 3D-Modell (UQFN-40-EP(5x5))

PIC18LF47K40-E/MV

MICROCHIP·UQFN-40-EP(5x5)

READY

41P5.0×5.0×0.50mmP=0.4mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24F16KL402-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24F16KL402-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PQFP-44(10x10) · 44P

HV5622PG-G (PQFP-44(10x10)) - 3D-Modell (PQFP-44(10x10))

HV5622PG-G

MICROCHIP·PQFP-44(10x10)

READY

44P10.0×10.0×2.20mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

SMD · 12P

MRF89XAM9A-I/RM (SMD) - 3D-Modell (SMD)

MRF89XAM9A-I/RM

READY

12P28.2×19.8×3.10mm2.1–3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

PDIP-40 · 40P

PIC16F871-I/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC16F871-I/P

MICROCHIP·PDIP-40

READY

40P50.3×13.7×4.20mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC32MX274F256BT-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.5V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64-EP(9x9) · 65P

PIC32MX664F128H-I/MR (QFN-64-EP(9x9)) - 3D-Modell (QFN-64-EP(9x9))

PIC32MX664F128H-I/MR

MICROCHIP·QFN-64-EP(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SO-8 · 8P

MIC29204YM (SO-8) - 3D-Modell (SO-8)

MIC29204YM

MICROCHIP·SO-8

READY

8P5.0×3.9×1.75mmP=1.27mm1.24V to 26V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

PIC24HJ32GP304-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC24HJ32GP304-I/PT

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.00mmP=0.8mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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