Elektronischer Bauteilkatalog — Schaltplansymbole, IPC-7351B Footprints & 3D STEP/GLB (Gehäuse VDFN · Seite 257)

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

SOIC-20-300mil · 8P

PIC16F1829T-I/SO

MICROCHIP(美国微芯)·SOIC-20-300mil

READY

8P

8/14/20引脚，8位闪存微控制器

SSOP-20-208mil · 8P

PIC16F1709T-I/SS

MICROCHIP(美国微芯)·SSOP-20-208mil

READY

8P

PIC16F1709T-I/SS

SOIC-28-300mil · 8P

PIC18F25K50T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18F25K50T-I/SO

SOIC-28-300mil · 8P

PIC18F258T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18F258T-I/SO

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

Bauteile (4104 Bauteilen · Seite 257/257)