4090 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4104 Bauteilen · Seite 257/257)

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SOIC-20-300mil · 8P

PIC18F14K50T-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC18F14K50T-I/SO

MICROCHIP(美国微芯)·SOIC-20-300mil

READY

8P

PIC18F14K50T-I/SO

MSOP-8 · 8P

MCP6292-H/MS (MSOP-8) - 3D-Modell (MSOP-8)

MCP6292-H/MS

MICROCHIP(美国微芯)·MSOP-8

READY

8P

MCP6292 H/MS

VQFN-100-EP(12x12) · 8P

USB7051T-I/KDX (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB7051T-I/KDX

MICROCHIP(美国微芯)·VQFN-100-EP(12x12)

READY

8P

USB7051T-I/KDX

MSOP-8 · 8P

MIC5219-2.5YMM-TR (MSOP-8) - 3D-Modell (MSOP-8)

MIC5219-2.5YMM-TR

MICROCHIP(美国微芯)·MSOP-8

READY

8P

MIC5219-2.5YMM-TR

QFN-28-EP(6x6) · 8P

PIC18LF27K40T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC18LF27K40T-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

PIC18LF27K40T-I/ML

QFN-28-EP(6x6) · 8P

PIC16F18855T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F18855T-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

PIC16F18855T-I/ML

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D-Modell (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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