3998 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4004 Bauteilen · Seite 250/251)

Zeige 3985–4000 von 4004 Bauteilen

Through Hole,Right Angle,P=2mm · 10P

HX PM2.0-1x10P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x10P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

10P22.0×6.3×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,D=5mm · 2P

HL-508H256WC-HD_6000K_ (Through Hole,D=5mm) - 3D-Modell (Through Hole,D=5mm)

HL-508H256WC-HD_6000K_

HONGLITRONIC·Through Hole,D=5mm

READY

2P5.0×5.0×7.70mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

- · 41P

ESP32-S2-SOLO-U-N4 (-) - 3D-Modell (-)

ESP32-S2-SOLO-U-N4

Espressif Systems·-

READY

41P19.2×18.0×3.10mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,20x18mm · 19P

ESP32-C3-WROOM-02-N4 (SMD,20x18mm) - 3D-Modell (SMD,20x18mm)

ESP32-C3-WROOM-02-N4

ESPRESSIF·SMD,20x18mm

READY

19P20.0×18.0×3.20mmP=1.5mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-41P · 41P

ESP32-S2-SOLO-2U-N4R2 (SMD-41P) - 3D-Modell (SMD-41P)

ESP32-S2-SOLO-2U-N4R2

ESPRESSIF·SMD-41P

READY

41P19.2×18.0×3.20mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SOP-16 · 16P

CH340G (SOP-16) - 3D-Modell (SOP-16)

CH340G

READY

16P9.9×3.9×1.75mmP=1.27mm3.3V to 5V

Schnittstellen-Bridge & Takt-/Timer-IC

LQFP-48(7x7) · 48P

STM32F103C8T6 (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

STM32F103C8T6

ST·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

SOP-16 · 16P

CH340C (SOP-16) - 3D-Modell (SOP-16)

CH340C

READY

16P9.9×3.9×1.75mmP=1.27mm

Schnittstellen-Bridge & Takt-/Timer-IC

SOT-223 · 4P

AMS1117-3.3 (SOT-223) - 3D-Modell (SOT-223)

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

Low-Dropout-Linearspannungsregler (LDO)

0805 · 2P

0805W8F1004T5E (0805) - 3D-Modell (0805)

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

LQFN-56(7x7) · 57P

RP2040 (LQFN-56(7x7)) - 3D-Modell (LQFN-56(7x7))

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

DIP-8 · 8P

NE555P (DIP-8) - 3D-Modell (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

UDFN-8L-EP(2x3) · 8P

24FC04HT-E/MUY (UDFN-8L-EP(2x3)) - 3D-Modell (UDFN-8L-EP(2x3))

24FC04HT-E/MUY

MICROCHIP(美国微芯)·UDFN-8L-EP(2x3)

READY

8P

4Kbit I2C串行EEPROM，带半阵列写保护

SMD3225-4P · 8P

DSC1001CL1-001.6000T (SMD3225-4P) - 3D-Modell (SMD3225-4P)

DSC1001CL1-001.6000T

MICROCHIP(美国微芯)·SMD3225-4P

READY

8P

±50ppm 1.8V~3.3V

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