Elektronischer Bauteilkatalog — Schaltplansymbole, IPC-7351B Footprints & 3D STEP/GLB (Gehäuse BULETM · Seite 238)

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

MLF-10(3x3) · 8P

MIC2212-GKBML-TR

MICROCHIP(美国微芯)·MLF-10(3x3)

READY

8P

2.6V 300mA 5.5V

VFBGA-400 · 8P

M2GL010T-VFG400I

MICROCHIP(美国微芯)·VFBGA-400

READY

8P

M2GL010T VFG400I

TSSOP-24 · 8P

LX1688CPW

MICROCHIP(美国微芯)·TSSOP-24

READY

8P

LX1688CPW

FPBGA-256(14x14) · 8P

M2GL010T-VFG256I

MICROCHIP(美国微芯)·FPBGA-256(14x14)

READY

8P

M2GL010T VFG256I

SOIC-8 · 8P

AT93C56-10SI-2.5

MICROCHIP(美国微芯)·SOIC-8

READY

8P

低电压和标准电压运行的3线串行接口EEPROM

SOIC-8 · 8P

93LC66CT-I/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

93LC66CT I/SN

FBGA-676 · 8P

M1A3PE1500-2FGG676I

MICROCHIP(美国微芯)·FBGA-676

READY

8P

M1A3PE1500 2FGG676I

VFBGA-400 · 8P

M2GL025TS-VFG400

MICROCHIP(美国微芯)·VFBGA-400

READY

8P

M2GL025TS-VFG400

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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