3778 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SMD,18x31mm · 43P

ESP32-S2-WROVER-I-N8R2 (SMD,18x31mm) - 3D-Modell (SMD,18x31mm)

ESP32-S2-WROVER-I-N8R2

ESPRESSIF·SMD,18x31mm

READY

43P31.0×18.0×3.30mmP=1.5mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD · 43P

ESP32-S2-WROOM(M22S2H3200PH3Q0) (SMD) - 3D-Modell (SMD)

ESP32-S2-WROOM(M22S2H3200PH3Q0)

READY

43P31.0×18.0×3.30mmP=1.5mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,31.4x18mm · 39P

ESP32-WROVER-B-N16R8 (SMD,31.4x18mm) - 3D-Modell (SMD,31.4x18mm)

ESP32-WROVER-B-N16R8

ESPRESSIF·SMD,31.4x18mm

READY

39P31.4×18.0×3.30mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SOP-8 · 8P

MAX3485ESA (SOP-8) - 3D-Modell (SOP-8)

MAX3485ESA

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

UFQFPN-48(7x7) · 49P

STM32F411CEU6 (UFQFPN-48(7x7)) - 3D-Modell (UFQFPN-48(7x7))

STM32F411CEU6

ST·UFQFPN-48(7x7)

READY

49P7.0×7.0×0.60mmP=0.5mm1.7 V to 3.6 V

Eingebetteter Mikrocontroller (MCU)

SMA(DO-214AC) · 2P

SS34 (SMA(DO-214AC)) - 3D-Modell (SMA(DO-214AC))

SS34

MDD(Microdiode Semiconductor)·SMA(DO-214AC)

READY

2P4.3×2.6×2.15mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOD-323 · 2P

B5819W (SOD-323) - 3D-Modell (SOD-323)

B5819W

HL(Haolin Elec)·SOD-323

READY

2P1.7×1.3×0.95mmP=2.4mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-223-4 · 4P

LM317DCYR (SOT-223-4) - 3D-Modell (SOT-223-4)

LM317DCYR

READY

4P6.5×3.5×1.60mmP=2.3mm1.25 V to 37 V

Low-Dropout-Linearspannungsregler (LDO)

SOIC-16 · 16P

SN74HC595DR (SOIC-16) - 3D-Modell (SOIC-16)

SN74HC595DR

READY

16P9.9×3.9×1.75mmP=1.27mm2 V to 6 V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-16-EP · 17P

DRV8833PWPR (TSSOP-16-EP) - 3D-Modell (TSSOP-16-EP)

DRV8833PWPR

TI·TSSOP-16-EP

READY

17P5.0×4.4×1.00mmP=0.65mm2.7 V to 10.8 V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-8 · 8P

INA219AIDCNR (SOT-23-8) - 3D-Modell (SOT-23-8)

INA219AIDCNR

READY

8P2.9×1.6×1.10mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23 · 3P

MCP1700T-3302E/TT(MS) (SOT-23) - 3D-Modell (SOT-23)

MCP1700T-3302E/TT(MS)

MSKSEMI·SOT-23

READY

3P2.9×1.3×1.10mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

ATTINY85-20SU (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

ATTINY85-20SU

MICROCHIP·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm1.8V - 2.4V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-16 · 16P

ULN2003ADR (SOIC-16) - 3D-Modell (SOIC-16)

ULN2003ADR

READY

16P9.9×3.9×1.75mmP=1.27mm6 V to 15 V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8_L2.5-W2.5-P0.50-BL-EP · 9P

C77361 (DFN-8_L2.5-W2.5-P0.50-BL-EP) - 3D-Modell (DFN-8_L2.5-W2.5-P0.50-BL-EP)

C77361

Generic·DFN-8_L2.5-W2.5-P0.50-BL-EP

READY

9P2.5×2.5×1.00mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

FS8205A (SOT-23-6) - 3D-Modell (SOT-23-6)

FS8205A

TECH PUBLIC·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm

Standard-Elektronik- & Steckverbinderbauteil

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