4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4124 Bauteilen · Seite 103/258)

Zeige 1633–1648 von 4124 Bauteilen

PBGA-272(27x27) · 272P

MT90869AG2 (PBGA-272(27x27)) - 3D-Modell (PBGA-272(27x27))

MT90869AG2

MICROCHIP·PBGA-272(27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

HSBGA-672(27x27) · 672P

VSC7420XJG-04 (HSBGA-672(27x27)) - 3D-Modell (HSBGA-672(27x27))

VSC7420XJG-04

MICROCHIP·HSBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-12(2x2) · 12P

LX7180A-31CLQ-TR (QFN-12(2x2)) - 3D-Modell (QFN-12(2x2))

LX7180A-31CLQ-TR

MICROCHIP·QFN-12(2x2)

READY

12P2.0×2.0×0.90mmP=0.5mm3.0 V - 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

272-PBGA (27x27) · 272P

70V5388S166BGI (272-PBGA (27x27)) - 3D-Modell (272-PBGA (27x27))

70V5388S166BGI

RENESAS·272-PBGA (27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

272-PBGA (27x27) · 272P

70V5388S166BG8 (272-PBGA (27x27)) - 3D-Modell (272-PBGA (27x27))

70V5388S166BG8

RENESAS·272-PBGA (27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

VFLGA-4 · 4P

DSC6121HI2A-0090 (VFLGA-4) - 3D-Modell (VFLGA-4)

DSC6121HI2A-0090

MICROCHIP·VFLGA-4

READY

4P1.2×1.6×1.15mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618437 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618437

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618439 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618439

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFG144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFG144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ1024EFE144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFE144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ1024EFM144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144T-250I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144T-250I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-361 · 361P

ATSAMA5D42B-CUR (TFBGA-361) - 3D-Modell (TFBGA-361)

ATSAMA5D42B-CUR

MICROCHIP·TFBGA-361

READY

361P16.0×16.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-3BG272 (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-3BG272

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-51P · 59P

ATSAMW25H18-MR210PB1954 (SMD-51P) - 3D-Modell (SMD-51P)

ATSAMW25H18-MR210PB1954

MICROCHIP·SMD-51P

READY

59P30.8×14.2×2.40mmP=1.2mm2.7 to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

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