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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3844 款元器件 · 第 97/241)

显示 1537–1552 共 3844 款元器件

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128589 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D模型 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128589

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

SMD-49P · 49P

RN171-I/RM481 (SMD-49P) - 3D模型 (SMD-49P)

RN171-I/RM481

MICROCHIP·SMD-49P

READY

49P17.8×26.7×3.18mmP=1.27mm

标准电子与连接器元件

SMD-43P · 43P

BM23SPKS1NB9-0B02AA (SMD-43P) - 3D模型 (SMD-43P)

BM23SPKS1NB9-0B02AA

MICROCHIP·SMD-43P

READY

43P29.0×15.0×2.40mmP=1.2mm3.0V to 4.2V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-36P · 37P

ATWINC3400-MR210UA143 (SMD-36P) - 3D模型 (SMD-36P)

ATWINC3400-MR210UA143

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD3225-6P · 6P

DSC1222CI2-212M5000 (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC1222CI2-212M5000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

标准电子与连接器元件

SMD7050-4P · 5P

DSC1001AI1-025.0000 (SMD7050-4P) - 3D模型 (SMD7050-4P)

DSC1001AI1-025.0000

MICROCHIP·SMD7050-4P

READY

5P7.0×5.0×2.00mm1.8 to 3.3 v

标准电子与连接器元件

SMD7050-4P · 5P

DSC1001AE1-003.6864 (SMD7050-4P) - 3D模型 (SMD7050-4P)

DSC1001AE1-003.6864

MICROCHIP·SMD7050-4P

READY

5P7.0×5.0×2.00mm1.8 to 3.3 v

标准电子与连接器元件

SMD1612-4P · 4P

DSC6121HI2A-00AMT (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6121HI2A-00AMT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

PBGA-256(27x27) · 272P

OR2T15B7BA256I-DB (PBGA-256(27x27)) - 3D模型 (PBGA-256(27x27))

OR2T15B7BA256I-DB

LATTICE(莱迪思)·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

标准电子与连接器元件

WFBGA-176 · 176P

MEC1723N-B0-I/LJ (WFBGA-176) - 3D模型 (WFBGA-176)

MEC1723N-B0-I/LJ

MICROCHIP·WFBGA-176

READY

176P10.0×10.0×1.35mmP=0.65mm

标准电子与连接器元件

PBGA-256(27x27) · 272P

OR2T10A5BA256-DB (PBGA-256(27x27)) - 3D模型 (PBGA-256(27x27))

OR2T10A5BA256-DB

Lattice·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

标准电子与连接器元件

WFBGA-48 · 48P

MX29SL802CBXHI-90G (WFBGA-48) - 3D模型 (WFBGA-48)

MX29SL802CBXHI-90G

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

CSP-201 · 201P

AGLP060V2-CSG201 (CSP-201) - 3D模型 (CSP-201)

AGLP060V2-CSG201

MICROCHIP·CSP-201

READY

201P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

标准电子与连接器元件

CSP-201 · 201P

AGLP030V2-CS201 (CSP-201) - 3D模型 (CSP-201)

AGLP030V2-CS201

MICROCHIP·CSP-201

READY

201P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

标准电子与连接器元件

PBGA-272 · 272P

A42MX36-1BGG272I (PBGA-272) - 3D模型 (PBGA-272)

A42MX36-1BGG272I

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

标准电子与连接器元件

HSBGA-672(27x27) · 672P

VSC7428XJG-12 (HSBGA-672(27x27)) - 3D模型 (HSBGA-672(27x27))

VSC7428XJG-12

MICROCHIP·HSBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm

标准电子与连接器元件

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