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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3461 款元器件 · 第 33/217)

显示 513–528 共 3461 款元器件

LQFP-32(7x7) · 32P

CH32V203K8T6 (LQFP-32(7x7)) - 3D模型 (LQFP-32(7x7))

CH32V203K8T6

WCH·LQFP-32(7x7)

READY

32P7.0×7.0×1.40mmP=0.8mm

嵌入式微控制器芯片 (MCU)

QFN-28-EP(5x5) · 29P

CP2102N-A02-GQFN28R (QFN-28-EP(5x5)) - 3D模型 (QFN-28-EP(5x5))

CP2102N-A02-GQFN28R

SILICON LABS·QFN-28-EP(5x5)

READY

29P5.0×5.0×0.75mmP=0.5mm

标准电子与连接器元件

TQFP-80(14x14) · 80P

DSPIC30F6014-30I/PF (TQFP-80(14x14)) - 3D模型 (TQFP-80(14x14))

DSPIC30F6014-30I/PF

MICROCHIP·TQFP-80(14x14)

READY

80P14.0×14.0×1.20mmP=0.65mm2.5V to 5.5V

标准电子与连接器元件

SMD-19P · 27P

ESP32-C3-WROOM-02U-N4 (SMD-19P) - 3D模型 (SMD-19P)

ESP32-C3-WROOM-02U-N4

ESPRESSIF·SMD-19P

READY

27P18.0×14.3×3.20mmP=1.5mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,21.2x18mm · 32P

ESP32-C5-WROOM-1U-N16R8-V1.2 (SMD,21.2x18mm) - 3D模型 (SMD,21.2x18mm)

ESP32-C5-WROOM-1U-N16R8-V1.2

ESPRESSIF·SMD,21.2x18mm

READY

32P21.2×18.0×3.30mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,21.2x18mm · 32P

ESP32-C5-WROOM-1U-N8R8-V1.2 (SMD,21.2x18mm) - 3D模型 (SMD,21.2x18mm)

ESP32-C5-WROOM-1U-N8R8-V1.2

ESPRESSIF·SMD,21.2x18mm

READY

32P21.2×18.0×3.30mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,13.2x12.5mm · 61P

ESP32-C6-MINI-1U-H4 (SMD,13.2x12.5mm) - 3D模型 (SMD,13.2x12.5mm)

ESP32-C6-MINI-1U-H4

ESPRESSIF·SMD,13.2x12.5mm

READY

61P13.2×12.5×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-28P · 37P

ESP32-C6-WROOM-1-N4 (SMD-28P) - 3D模型 (SMD-28P)

ESP32-C6-WROOM-1-N4

ESPRESSIF·SMD-28P

READY

37P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,25.5x18mm · 37P

ESP32-C6-WROOM-1-N8 (SMD,25.5x18mm) - 3D模型 (SMD,25.5x18mm)

ESP32-C6-WROOM-1-N8

ESPRESSIF·SMD,25.5x18mm

READY

37P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-65P · 65P

ESP32-S2-MINI-1-N4R2 (SMD-65P) - 3D模型 (SMD-65P)

ESP32-S2-MINI-1-N4R2

ESPRESSIF·SMD-65P

READY

65P20.0×15.4×2.40mmP=0.85mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,18x31mm · 43P

ESP32-S2-WROVER-N8R2 (SMD,18x31mm) - 3D模型 (SMD,18x31mm)

ESP32-S2-WROVER-N8R2

ESPRESSIF·SMD,18x31mm

READY

43P31.0×18.0×3.30mmP=1.5mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,31.4x18mm · 39P

ESP32-WROVER-IE(8MB) (SMD,31.4x18mm) - 3D模型 (SMD,31.4x18mm)

ESP32-WROVER-IE(8MB)

ESPRESSIF·SMD,31.4x18mm

READY

39P31.4×18.0×3.30mmP=1.27mm

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

STM-32(5x5) · 33P

HMC570LC5TR (STM-32(5x5)) - 3D模型 (STM-32(5x5))

HMC570LC5TR

ADI·STM-32(5x5)

READY

33P5.0×5.0×0.85mmP=0.5mm

标准电子与连接器元件

VFBGA-78 · 78P

HV2802GA-G (VFBGA-78) - 3D模型 (VFBGA-78)

HV2802GA-G

MICROCHIP·VFBGA-78

READY

78P9.0×9.0×1.00mmP=0.65mm

标准电子与连接器元件

VFBGA-78 · 78P

HV2902GA-G (VFBGA-78) - 3D模型 (VFBGA-78)

HV2902GA-G

MICROCHIP·VFBGA-78

READY

78P9.0×9.0×1.00mmP=0.65mm

标准电子与连接器元件

VQFN-43-EP(7x7) · 45P

HV56020T-V/KXX (VQFN-43-EP(7x7)) - 3D模型 (VQFN-43-EP(7x7))

HV56020T-V/KXX

MICROCHIP·VQFN-43-EP(7x7)

READY

45P7.0×7.0×0.90mmP=0.5mm2.7V to 5.5V

标准电子与连接器元件

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