Elektronischer Bauteilkatalog — Schaltplansymbole, IPC-7351B Footprints & 3D STEP/GLB (Gehäuse TFSOP · Seite 247)

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

TQFP-64(10x10) · 8P

PIC24EP512GP806-I/PT

MICROCHIP(美国微芯)·TQFP-64(10x10)

READY

8P

PIC24EP512GP806-I/PT

QFN-28-EP(6x6) · 8P

PIC18F2580-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

采用ECAN技术、10位A/D和微功耗技术的28/40/44引脚增强型闪存微控制器

PLCC-32(11.4x14) · 8P

AT27C020-55JU

MICROCHIP(美国微芯)·PLCC-32(11.4x14)

READY

8P

AT27C020-55JU

SOIC-18-300mil · 8P

PIC18F1320-I/SO

MICROCHIP(美国微芯)·SOIC-18-300mil

READY

8P

高性能、低功耗带10位A/D的增强型闪存微控制器，具备多种电源管理模式、多振荡器选项和特殊功能

TQFP-32(7x7) · 8P

ATMEGA88V-10AU

MICROCHIP(美国微芯)·TQFP-32(7x7)

READY

8P

ATMEGA88V-10AU

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

Bauteile (3944 Bauteilen · Seite 247/247)