SMD-38P · 39P미리보기실물 사진3D CADPinoutFootprint치수ESP32-WROOM-32E(M113EH6400PH3Q0)ESPRESSIF·SMD-38PREADY39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 VWi-Fi / Bluetooth LE 무선 SoC 모듈
DIP-8 · 8P미리보기실물 사진3D CADPinoutFootprint치수NE555PTI·DIP-8READY8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V인터페이스 브리지 및 클럭/타이머 IC
TQFP-32(7x7) · 32P미리보기실물 사진3D CADPinoutFootprint치수ATMEGA328P-AUMICROCHIP·TQFP-32(7x7)READY32P7.0×7.0×1.00mmP=0.8mm임베디드 마이크로컨트롤러 (MCU)
TQFP-64(10x10) · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC24EP512GP806-I/PTMICROCHIP(美国微芯)·TQFP-64(10x10)READY8PPIC24EP512GP806-I/PT
QFN-28-EP(6x6) · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC18F2580-I/MLMICROCHIP(美国微芯)·QFN-28-EP(6x6)READY8P采用ECAN技术、10位A/D和微功耗技术的28/40/44引脚增强型闪存微控制器
PLCC-32(11.4x14) · 8P미리보기실물 사진3D CADPinoutFootprint치수AT27C020-55JUMICROCHIP(美国微芯)·PLCC-32(11.4x14)READY8PAT27C020-55JU
SOIC-18-300mil · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC18F1320-I/SOMICROCHIP(美国微芯)·SOIC-18-300milREADY8P高性能、低功耗带10位A/D的增强型闪存微控制器,具备多种电源管理模式、多振荡器选项和特殊功能
TQFP-32(7x7) · 8P미리보기실물 사진3D CADPinoutFootprint치수ATMEGA88V-10AUMICROCHIP(美国微芯)·TQFP-32(7x7)READY8PATMEGA88V-10AU
TQFP-44(10x10) · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC24FJ48GA004-I/PTMICROCHIP(美国微芯)·TQFP-44(10x10)READY8PPIC24FJ48GA004-I/PT
TQFP-64(10x10) · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC32MX440F256H-80I/PTMICROCHIP(美国微芯)·TQFP-64(10x10)READY8P高性能、通用和USB 32位闪存微控制器
LQFP-100(14x14) · 8P미리보기실물 사진3D CADPinoutFootprint치수ATSAM3S1CB-AURMICROCHIP(美国微芯)·LQFP-100(14x14)READY8PATSAM3S1CB-AUR
SSOP-28-208mil · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC32MM0128GPM028T-I/SSMICROCHIP(美国微芯)·SSOP-28-208milREADY8PPIC32MM0128GPM028T-I/SS
SSOP-20-5.2mm · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC16F628-20I/SSMICROCHIP(美国微芯)·SSOP-20-5.2mmREADY8PPIC16F628-20I/SS
SSOP-28-208mil · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC18LF26K80-I/SSMICROCHIP(美国微芯)·SSOP-28-208milREADY8PPIC18LF26K80-I/SS
TQFP-64(10x10) · 8P미리보기실물 사진3D CADPinoutFootprint치수PIC18F66J11-I/PTMICROCHIP(美国微芯)·TQFP-64(10x10)READY8P64/80引脚,高性能,1 Mbit闪存微控制器