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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4104 款元器件 · 第 192/257)

显示 3057–3072 共 4104 款元器件

WLCSP-104(4.1x5.1) · 104P

STM32L162VEY6TR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L162VEY6TR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.56mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-72(3.8x4.4) · 72P

STM32L476JEY6VTR (WLCSP-72(3.8x4.4)) - 3D模型 (WLCSP-72(3.8x4.4))

STM32L476JEY6VTR

ST·WLCSP-72(3.8x4.4)

READY

72P3.8×4.4×0.56mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H745XIH6 (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H745XIH6

READY

265P14.0×14.0×1.10mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32F427IGH6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32F427IGH6

READY

201P10.0×10.0×0.60mmP=0.65mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F423VHH6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F423VHH6

READY

100P7.0×7.0×0.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132 · 132P

STM32L162QDH6 (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L162QDH6

READY

132P7.0×7.0×0.53mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132 · 132P

STM32L162QCH6 (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L162QCH6

READY

132P7.0×7.0×0.53mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132 · 132P

STM32L4S5QII3P (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L4S5QII3P

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F072V8H6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F072V8H6

READY

100P7.0×7.0×0.60mmP=0.5mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-216 · 216P

STM32F765NIH6TR (TFBGA-216) - 3D模型 (TFBGA-216)

STM32F765NIH6TR

READY

216P13.0×13.0×1.10mmP=0.8mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

SMD,P=0.8mm · 101P

658855603100 (SMD,P=0.8mm) - 3D模型 (SMD,P=0.8mm)

658855603100

Wurth(伍尔特)·SMD,P=0.8mm

READY

101P45.8×6.0×2.00mmP=0.8mm

标准电子与连接器元件

WLCSP-143(4.5x5.8) · 143P

STM32F746ZEY6TR (WLCSP-143(4.5x5.8)) - 3D模型 (WLCSP-143(4.5x5.8))

STM32F746ZEY6TR

ST·WLCSP-143(4.5x5.8)

READY

143P5.8×4.5×0.56mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-18(1.9x2.1) · 18P

STM32G041Y8Y6TR (WLCSP-18(1.9x2.1)) - 3D模型 (WLCSP-18(1.9x2.1))

STM32G041Y8Y6TR

ST·WLCSP-18(1.9x2.1)

READY

18P2.1×1.9×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H725IEK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H725IEK6

READY

201P10.0×10.0×0.60mmP=0.65mm1.62 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7x0.5) · 132P

STM32L562QEI6 (UFBGA-132(7x7x0.5)) - 3D模型 (UFBGA-132(7x7x0.5))

STM32L562QEI6

ST·UFBGA-132(7x7x0.5)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LFBGA-448 · 448P

STM32MP151DAA1 (LFBGA-448) - 3D模型 (LFBGA-448)

STM32MP151DAA1

READY

448P18.0×18.0×1.20mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

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