3786 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3804 款元器件 · 第 93/238)

显示 1473–1488 共 3804 款元器件

SMD1612-4P · 4P

DSC6023HI2A-00A7 (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6023HI2A-00A7

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

SMD1612-4P · 4P

DSC6023HI2A-00ACT (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6023HI2A-00ACT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

SMD1612-4P · 4P

DSC6023HI2A-00A5T (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6023HI2A-00A5T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGEB-54.0000T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGEB-54.0000T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGEB-22.0000T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGEB-22.0000T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGED-33.333333T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGED-33.333333T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGGC-35.3280T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGGC-35.3280T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGGC-33.0000T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGGC-33.0000T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128589 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D模型 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128589

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

SMD-49P · 49P

RN171-I/RM481 (SMD-49P) - 3D模型 (SMD-49P)

RN171-I/RM481

MICROCHIP·SMD-49P

READY

49P17.8×26.7×3.18mmP=1.27mm

标准电子与连接器元件

SMD-43P · 43P

BM23SPKS1NB9-0B02AA (SMD-43P) - 3D模型 (SMD-43P)

BM23SPKS1NB9-0B02AA

MICROCHIP·SMD-43P

READY

43P29.0×15.0×2.40mmP=1.2mm3.0V to 4.2V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-36P · 37P

ATWINC3400-MR210UA143 (SMD-36P) - 3D模型 (SMD-36P)

ATWINC3400-MR210UA143

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD3225-6P · 6P

DSC1222CI2-212M5000 (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC1222CI2-212M5000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

标准电子与连接器元件

SMD7050-4P · 5P

DSC1001AI1-025.0000 (SMD7050-4P) - 3D模型 (SMD7050-4P)

DSC1001AI1-025.0000

MICROCHIP·SMD7050-4P

READY

5P7.0×5.0×2.00mm1.8 to 3.3 v

标准电子与连接器元件

SMD7050-4P · 5P

DSC1001AE1-003.6864 (SMD7050-4P) - 3D模型 (SMD7050-4P)

DSC1001AE1-003.6864

MICROCHIP·SMD7050-4P

READY

5P7.0×5.0×2.00mm1.8 to 3.3 v

标准电子与连接器元件

SMD1612-4P · 4P

DSC6121HI2A-00AMT (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6121HI2A-00AMT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

探索器件库封装厂商上传