3673 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3678 款元器件 · 第 76/230)

显示 1201–1216 共 3678 款元器件

TFBGA-144 · 144P

PIC32MZ2048EFG144T-I/JWX (TFBGA-144) - 3D模型 (TFBGA-144)

PIC32MZ2048EFG144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

标准电子与连接器元件

TFBGA-144 · 144P

PIC32MZ1024EFE144T-E/JWX (TFBGA-144) - 3D模型 (TFBGA-144)

PIC32MZ1024EFE144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

标准电子与连接器元件

TFBGA-144 · 144P

PIC32MZ1024EFM144T-E/JWX (TFBGA-144) - 3D模型 (TFBGA-144)

PIC32MZ1024EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

标准电子与连接器元件

TFBGA-144 · 144P

PIC32MZ2048EFH144T-250I/JWX (TFBGA-144) - 3D模型 (TFBGA-144)

PIC32MZ2048EFH144T-250I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

标准电子与连接器元件

TFBGA-361 · 361P

ATSAMA5D42B-CUR (TFBGA-361) - 3D模型 (TFBGA-361)

ATSAMA5D42B-CUR

MICROCHIP·TFBGA-361

READY

361P16.0×16.0×1.12mmP=0.8mm

标准电子与连接器元件

PBGA-272 · 272P

A42MX36-3BG272 (PBGA-272) - 3D模型 (PBGA-272)

A42MX36-3BG272

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

标准电子与连接器元件

SMD-51P · 59P

ATSAMW25H18-MR210PB1954 (SMD-51P) - 3D模型 (SMD-51P)

ATSAMW25H18-MR210PB1954

MICROCHIP·SMD-51P

READY

59P30.8×14.2×2.40mmP=1.2mm2.7 to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

PBGA-324(23x23) · 324P

ZL50118GAG2 (PBGA-324(23x23)) - 3D模型 (PBGA-324(23x23))

ZL50118GAG2

MICROCHIP·PBGA-324(23x23)

READY

324P23.0×23.0×1.35mmP=1mm

标准电子与连接器元件

PBGA-256(27x27) · 272P

OR2T10A4BA256I-DB (PBGA-256(27x27)) - 3D模型 (PBGA-256(27x27))

OR2T10A4BA256I-DB

Lattice·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

标准电子与连接器元件

UFBGA-88(6x6) · 88P

ATMXT640UD-CCUR002 (UFBGA-88(6x6)) - 3D模型 (UFBGA-88(6x6))

ATMXT640UD-CCUR002

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

标准电子与连接器元件

VFBGA-64(5.5x5.5) · 64P

CEC1736-S0-I/2HW-PROTO (VFBGA-64(5.5x5.5)) - 3D模型 (VFBGA-64(5.5x5.5))

CEC1736-S0-I/2HW-PROTO

MICROCHIP·VFBGA-64(5.5x5.5)

READY

64P5.5×5.5×0.80mmP=0.5mm

标准电子与连接器元件

UFBGA-136(7x7) · 136P

ATMXT1664T3-CCUR035 (UFBGA-136(7x7)) - 3D模型 (UFBGA-136(7x7))

ATMXT1664T3-CCUR035

MICROCHIP·UFBGA-136(7x7)

READY

136P7.0×7.0×0.60mmP=0.5mm1.8V to 3.3V

标准电子与连接器元件

UFBGA-88(6x6) · 88P

ATMXT640UD-CCU001 (UFBGA-88(6x6)) - 3D模型 (UFBGA-88(6x6))

ATMXT640UD-CCU001

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

标准电子与连接器元件

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128595 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D模型 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128595

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

QFN-64(7x7) · 65P

ATMEGA169PV-8MCH (QFN-64(7x7)) - 3D模型 (QFN-64(7x7))

ATMEGA169PV-8MCH

MICROCHIP·QFN-64(7x7)

READY

65P7.0×7.0×1.35mmP=0.65mm1.8V - 5.5V

嵌入式微控制器芯片 (MCU)

SMD-36P · 37P

ATWINC3400-MR210CA122-T (SMD-36P) - 3D模型 (SMD-36P)

ATWINC3400-MR210CA122-T

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

探索器件库封装厂商上传