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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3984 款元器件 · 第 56/249)

显示 881–896 共 3984 款元器件

WLCSP-80(3.3x3.5) · 80P

STM32H573MIY3QTR (WLCSP-80(3.3x3.5)) - 3D模型 (WLCSP-80(3.3x3.5))

STM32H573MIY3QTR

ST·WLCSP-80(3.3x3.5)

READY

80P3.3×3.5×0.55mmP=0.35mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-100(14x14) · 100P

STM32F103VDT7 (LQFP-100(14x14)) - 3D模型 (LQFP-100(14x14))

STM32F103VDT7

ST·LQFP-100(14x14)

READY

100P14.0×14.0×1.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

TFBGA-64 · 64P

STM32L152R8H6 (TFBGA-64) - 3D模型 (TFBGA-64)

STM32L152R8H6

READY

64P5.0×5.0×1.20mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-48(7x7) · 49P

STM32G031C8U7 (UFQFPN-48(7x7)) - 3D模型 (UFQFPN-48(7x7))

STM32G031C8U7

ST·UFQFPN-48(7x7)

READY

49P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

LQFP-44-(20x20) · 144P

STM32H523ZCT6 (LQFP-44-(20x20)) - 3D模型 (LQFP-44-(20x20))

STM32H523ZCT6

ST·LQFP-44-(20x20)

READY

144P20.0×20.0×1.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-64(10x10) · 64P

STM32F051R8T6TR (LQFP-64(10x10)) - 3D模型 (LQFP-64(10x10))

STM32F051R8T6TR

ST·LQFP-64(10x10)

READY

64P10.0×10.0×1.60mmP=0.5mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-216 · 216P

STM32F746NGH6TR (TFBGA-216) - 3D模型 (TFBGA-216)

STM32F746NGH6TR

READY

216P13.0×13.0×1.12mmP=0.8mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-64(10x10) · 64P

STM32L4A6RGT6TR (LQFP-64(10x10)) - 3D模型 (LQFP-64(10x10))

STM32L4A6RGT6TR

ST·LQFP-64(10x10)

READY

64P10.0×10.0×1.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-64 · 64P

STM32F103R8H6TR (BGA-64) - 3D模型 (BGA-64)

STM32F103R8H6TR

READY

64P5.0×5.0×1.20mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFQFPN-32(5x5) · 33P

STM32L051K8U7TR (UFQFPN-32(5x5)) - 3D模型 (UFQFPN-32(5x5))

STM32L051K8U7TR

ST·UFQFPN-32(5x5)

READY

33P5.0×5.0×0.55mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-36 · 36P

STM32F410TBY6TR (WLCSP-36) - 3D模型 (WLCSP-36)

STM32F410TBY6TR

READY

36P2.6×2.6×0.56mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-48(7x7) · 48P

STM32F302CCT6TR (LQFP-48(7x7)) - 3D模型 (LQFP-48(7x7))

STM32F302CCT6TR

ST·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-32(5x5) · 33P

STM32F051K6U6TR (UFQFPN-32(5x5)) - 3D模型 (UFQFPN-32(5x5))

STM32F051K6U6TR

ST·UFQFPN-32(5x5)

READY

33P5.0×5.0×0.55mmP=0.5mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-28(4x4) · 28P

STM32L031G6U7STR (UFQFPN-28(4x4)) - 3D模型 (UFQFPN-28(4x4))

STM32L031G6U7STR

ST·UFQFPN-28(4x4)

READY

28P4.0×4.0×0.60mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-81 · 81P

STM32L476MEY6TR (UFBGA-81) - 3D模型 (UFBGA-81)

STM32L476MEY6TR

READY

81P4.7×3.8×0.58mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-81 · 81P

STM32F446MCY6TR (UFBGA-81) - 3D模型 (UFBGA-81)

STM32F446MCY6TR

READY

81P3.8×3.7×0.60mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

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