电子元器件目录 — 原理图符号、IPC-7351B 封装焊盘与 3D STEP/GLB (封装 MAP · 页码 258)

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

接口转换与时钟定时器芯片

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

SOIC-8 · 8P

MICRF022YM-FS48-TR

MICROCHIP(美国微芯)·SOIC-8

READY

8P

MICRF022YM-FS48-TR

TSSOP-14 · 8P

PIC16LF1615T-I/ST

MICROCHIP(美国微芯)·TSSOP-14

READY

8P

PIC16LF1615T-I/ST

TSSOP-14 · 8P

PIC16LF1764T-I/ST

MICROCHIP(美国微芯)·TSSOP-14

READY

8P

PIC16LF1764T-I/ST

TFBGA-48(6x8) · 8P

SST39VF801C-70-4C-B3KE-T

MICROCHIP(美国微芯)·TFBGA-48(6x8)

READY

8P

SST39VF801C-70-4C-B3KE-T

MSOP-8 · 8P

TC1321EUATR

MICROCHIP(美国微芯)·MSOP-8

READY

8P

TC1321 10bit数模转换器，带两线

MSOP-10 · 8P

TC1304-ZP0EUNTR

MICROCHIP(美国微芯)·MSOP-10

READY

8P

TC1304-ZP0EUNTR

MSOP-8 · 8P

TC1302B-IPVUATR

MICROCHIP(美国微芯)·MSOP-8

READY

8P

TC1302B-IPVUATR

SOIC-8 · 8P

MIC5239-1.8YM-TR

MICROCHIP(美国微芯)·SOIC-8

READY

8P

MIC5239-1.8YM-TR

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

器件库 (4124 款元器件 · 第 258/258)