4074 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4084 款元器件 · 第 256/256)

显示 4081–4084 共 4084 款元器件

MSOP-8 · 8P

MCP4802-E/MS (MSOP-8) - 3D模型 (MSOP-8)

MCP4802-E/MS

MICROCHIP(美国微芯)·MSOP-8

READY

8P

双电压输出数模转换器，具备轨到轨输出、SPI接口、双DAC同步锁存和快速建立时间等特性

SOIC-20-300mil · 8P

PIC16F1709-I/SO (SOIC-20-300mil) - 3D模型 (SOIC-20-300mil)

PIC16F1709-I/SO

MICROCHIP(美国微芯)·SOIC-20-300mil

READY

8P

PIC16F1709-I/SO

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D模型 (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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