3998 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4004 款元器件 · 第 251/251)

显示 4001–4004 共 4004 款元器件

TSSOP-8 · 8P

93C66BT-I/ST (TSSOP-8) - 3D模型 (TSSOP-8)

93C66BT-I/ST

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

93C66BT I/ST

MLF-6 · 8P

MIC5321-MFYML-TR (MLF-6) - 3D模型 (MLF-6)

MIC5321-MFYML-TR

MICROCHIP(美国微芯)·MLF-6

READY

8P

MIC5321-MFYML-TR

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D模型 (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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