电子元器件目录 — 原理图符号、IPC-7351B 封装焊盘与 3D STEP/GLB (封装 COMM · 页码 249)

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

接口转换与时钟定时器芯片

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

SOIC-8 · 8P

93LC66X/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

2.5V低功耗Microwire串行EEPROM，

MSOP-8 · 8P

25AA640A-E/MS

MICROCHIP(美国微芯)·MSOP-8

READY

8P

64K SPI总线串行EEPROM

PDIP-8 · 8P

93LC46-I/P

MICROCHIP(美国微芯)·PDIP-8

READY

8P

1K/2K/4K 2.5V 微线串行EEPROM

SOIC-8 · 8P

SST26VF020A-104I/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

SST26VF020A 104I/SN

SOIC-8 · 8P

AT21CS01-SSHM15-T

MICROCHIP(美国微芯)·SOIC-8

READY

8P

AT21CS01 SSHM15 T

SOIC-8 · 8P

93C46A-E/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

93C46A E/SN

SOIC-8 · 8P

93LC76B-E/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

低功耗CMOS技术8Kbit串行EEPROM，支持16bit字组织，工业级温度范围，单总线接口

SOIC-8 · 8P

24LC014H-I/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

1Kbit I²C串行EEPROM，半阵列写保护

QFN-28-EP(6x6) · 8P

PIC16LF1713T-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

PIC16LF1713T-I/ML

DFN-8-EP(2x3) · 8P

MCP1703T-4002E/MC

MICROCHIP(美国微芯)·DFN-8-EP(2x3)

READY

8P

MCP1703T-4002E/MC

TSSOP-8 · 8P

AT24CS64-XHM-B

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

64Kbit I2C兼容串行EEPROM，带唯一128bit 序列号

PDIP-8 · 8P

34LC02-I/P

MICROCHIP(美国微芯)·PDIP-8

READY

8P

34LC02 I/P

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

器件库 (3984 款元器件 · 第 249/249)