3774 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3784 款元器件 · 第 237/237)

显示 3777–3784 共 3784 款元器件

CSPBGA-536 · 8P

M2GL150TS-1FCSG536I (CSPBGA-536) - 3D模型 (CSPBGA-536)

M2GL150TS-1FCSG536I

MICROCHIP(美国微芯)·CSPBGA-536

READY

8P

M2GL150TS 1FCSG536I

FPBGA-256 · 8P

A54SX72A-FFGG256 (FPBGA-256) - 3D模型 (FPBGA-256)

A54SX72A-FFGG256

MICROCHIP(美国微芯)·FPBGA-256

READY

8P

A54SX72A-FFGG256

FPBGA-144 · 8P

APA300-FG144I (FPBGA-144) - 3D模型 (FPBGA-144)

APA300-FG144I

MICROCHIP(美国微芯)·FPBGA-144

READY

8P

APA300 FG144I

FPBGA-256 · 8P

M1AGL600V5-FGG256 (FPBGA-256) - 3D模型 (FPBGA-256)

M1AGL600V5-FGG256

MICROCHIP(美国微芯)·FPBGA-256

READY

8P

M1AGL600V5-FGG256

FPBGA-144 · 8P

A3P125-FGG144T (FPBGA-144) - 3D模型 (FPBGA-144)

A3P125-FGG144T

MICROCHIP(美国微芯)·FPBGA-144

READY

8P

A3P125 FGG144T

VSOP-40 · 8P

AT27C4096-55VI (VSOP-40) - 3D模型 (VSOP-40)

AT27C4096-55VI

MICROCHIP(美国微芯)·VSOP-40

READY

8P

低功耗高性能OTP EPROM

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D模型 (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D模型 (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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