4114 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4124 款元器件 · 第 206/258)

显示 3281–3296 共 4124 款元器件

UFBGA-132 · 132P

STM32L4S5QII6 (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L4S5QII6

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32L152V8H6TR (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L152V8H6TR

READY

100P7.0×7.0×0.58mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132 · 132P

STM32L4R5QGI6TR (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L4R5QGI6TR

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32L462VEI6TR (UFBGA-100) - 3D模型 (UFBGA-100)

STM32L462VEI6TR

READY

100P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-132 · 132P

STM32L162QDH6TR (BGA-132) - 3D模型 (BGA-132)

STM32L162QDH6TR

READY

132P7.0×7.0×1.35mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132 · 132P

STM32L486QGI6TR (UFBGA-132) - 3D模型 (UFBGA-132)

STM32L486QGI6TR

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-100 · 100P

STM32L162VCH6TR (BGA-100) - 3D模型 (BGA-100)

STM32L162VCH6TR

READY

100P7.0×7.0×1.60mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F303VEH6TR (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F303VEH6TR

READY

100P7.0×7.0×0.53mmP=0.5mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-132 · 132P

STM32L162QDH6DTR (BGA-132) - 3D模型 (BGA-132)

STM32L162QDH6DTR

READY

132P7.0×7.0×1.35mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U575QII6Q (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U575QII6Q

ST·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-265(14x14) · 265P

STM32H743XIH6TR (BGA-265(14x14)) - 3D模型 (BGA-265(14x14))

STM32H743XIH6TR

ST·BGA-265(14x14)

READY

265P14.0×14.0×1.35mmP=0.8mm

嵌入式微控制器芯片 (MCU)

- · 84P

LCKFB-LSPI-SkyStar-STM32F407VGT6-PRO (-) - 3D模型 (-)

LCKFB-LSPI-SkyStar-STM32F407VGT6-PRO

READY

84P45.0×69.9×3.85mm

嵌入式微控制器芯片 (MCU)

WLCSP-25(2.3x2.5) · 25P

STM32G071EBY6TR (WLCSP-25(2.3x2.5)) - 3D模型 (WLCSP-25(2.3x2.5))

STM32G071EBY6TR

ST·WLCSP-25(2.3x2.5)

READY

25P2.5×2.3×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H755IIK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H755IIK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

BGA-176 · 201P

GD32F470IKH6 (BGA-176) - 3D模型 (BGA-176)

GD32F470IKH6

GigaDevice Semicon Beijing·BGA-176

READY

201P10.0×10.0×1.35mmP=0.65mm

标准电子与连接器元件

UFBGA-176 · 201P

STM32F765IIK6 (UFBGA-176) - 3D模型 (UFBGA-176)

STM32F765IIK6

READY

201P10.0×10.0×0.53mmP=0.65mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

探索器件库封装厂商上传