3945 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3964 款元器件 · 第 196/248)

显示 3121–3136 共 3964 款元器件

UFBGA-132(7x7) · 132P

STM32U575QII6Q (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U575QII6Q

ST·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

BGA-265(14x14) · 265P

STM32H743XIH6TR (BGA-265(14x14)) - 3D模型 (BGA-265(14x14))

STM32H743XIH6TR

ST·BGA-265(14x14)

READY

265P14.0×14.0×1.35mmP=0.8mm

嵌入式微控制器芯片 (MCU)

- · 84P

LCKFB-LSPI-SkyStar-STM32F407VGT6-PRO (-) - 3D模型 (-)

LCKFB-LSPI-SkyStar-STM32F407VGT6-PRO

READY

84P45.0×69.9×3.85mm

嵌入式微控制器芯片 (MCU)

WLCSP-25(2.3x2.5) · 25P

STM32G071EBY6TR (WLCSP-25(2.3x2.5)) - 3D模型 (WLCSP-25(2.3x2.5))

STM32G071EBY6TR

ST·WLCSP-25(2.3x2.5)

READY

25P2.5×2.3×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H755IIK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H755IIK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

BGA-176 · 201P

GD32F470IKH6 (BGA-176) - 3D模型 (BGA-176)

GD32F470IKH6

GigaDevice Semicon Beijing·BGA-176

READY

201P10.0×10.0×1.35mmP=0.65mm

标准电子与连接器元件

UFBGA-176 · 201P

STM32F765IIK6 (UFBGA-176) - 3D模型 (UFBGA-176)

STM32F765IIK6

READY

201P10.0×10.0×0.53mmP=0.65mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U575QII6 (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U575QII6

ST(意法半导体)·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-201(10x10) · 201P

STM32F469IGH6TR (UFBGA-201(10x10)) - 3D模型 (UFBGA-201(10x10))

STM32F469IGH6TR

ST·UFBGA-201(10x10)

READY

201P10.0×10.0×0.58mmP=0.65mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LFBGA-354 · 354P

STM32MP153DAB1 (LFBGA-354) - 3D模型 (LFBGA-354)

STM32MP153DAB1

READY

354P16.0×16.0×1.35mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-216(13x13) · 216P

STM32F469NIH6 (TFBGA-216(13x13)) - 3D模型 (TFBGA-216(13x13))

STM32F469NIH6

ST·TFBGA-216(13x13)

READY

216P13.0×13.0×1.10mmP=0.8mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H755IIK3 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H755IIK3

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

WLCSP-66(3.8x4.2) · 66P

STM32F378RCY6TR (WLCSP-66(3.8x4.2)) - 3D模型 (WLCSP-66(3.8x4.2))

STM32F378RCY6TR

ST·WLCSP-66(3.8x4.2)

READY

66P4.2×3.8×0.57mmP=0.4mm

嵌入式微控制器芯片 (MCU)

WLCSP-180(5.5x6) · 180P

STM32F769AIY6TR (WLCSP-180(5.5x6)) - 3D模型 (WLCSP-180(5.5x6))

STM32F769AIY6TR

ST·WLCSP-180(5.5x6)

READY

180P5.5×6.0×0.56mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H757XIH6U (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H757XIH6U

READY

265P14.0×14.0×1.12mmP=0.8mm

嵌入式微控制器芯片 (MCU)

BGA240_14x14x1.07 · 265P

GD32H75EYMJ7 (BGA240_14x14x1.07) - 3D模型 (BGA240_14x14x1.07)

GD32H75EYMJ7

STMicroelectronics·BGA240_14x14x1.07

READY

265P14.0×14.0×1.35mmP=0.8mm

标准电子与连接器元件

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