4094 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4104 款元器件 · 第 193/257)

显示 3073–3088 共 4104 款元器件

UFBGA-73 · 73P

STM32WLE5J8I6 (UFBGA-73) - 3D模型 (UFBGA-73)

STM32WLE5J8I6

READY

73P5.0×5.0×0.58mmP=0.5mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F401VEH6TR (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F401VEH6TR

READY

100P7.0×7.0×0.53mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-129 · 129P

STM32WB55VCQ6 (UFBGA-129) - 3D模型 (UFBGA-129)

STM32WB55VCQ6

READY

129P7.0×7.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

LFBGA-448 · 448P

STM32MP153CAA3 (LFBGA-448) - 3D模型 (LFBGA-448)

STM32MP153CAA3

READY

448P18.0×18.0×1.20mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H743XGH6 (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H743XGH6

READY

265P14.0×14.0×1.10mmP=0.8mm

嵌入式微控制器芯片 (MCU)

WLCSP-90 · 90P

STM32U575OIY6QTR (WLCSP-90) - 3D模型 (WLCSP-90)

STM32U575OIY6QTR

READY

90P4.0×4.2×0.56mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LFBGA-448 · 448P

STM32MP157DAA1 (LFBGA-448) - 3D模型 (LFBGA-448)

STM32MP157DAA1

READY

448P18.0×18.0×1.20mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100(7x7) · 100P

STM32U535VEI6Q (UFBGA-100(7x7)) - 3D模型 (UFBGA-100(7x7))

STM32U535VEI6Q

ST·UFBGA-100(7x7)

READY

100P7.0×7.0×0.53mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-129 · 129P

STM32WB55VGQ6 (UFBGA-129) - 3D模型 (UFBGA-129)

STM32WB55VGQ6

READY

129P7.0×7.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F401VBH3 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F401VBH3

READY

100P7.0×7.0×0.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L151VEY6TR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L151VEY6TR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.56mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L151VDY6XTR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L151VDY6XTR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.56mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-25(2.3x2.5) · 25P

STM32G071EBY3TR (WLCSP-25(2.3x2.5)) - 3D模型 (WLCSP-25(2.3x2.5))

STM32G071EBY3TR

ST·WLCSP-25(2.3x2.5)

READY

25P2.5×2.3×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-52 · 52P

STM32G0B1NEY6TR (WLCSP-52) - 3D模型 (WLCSP-52)

STM32G0B1NEY6TR

ST(意法半导体)·WLCSP-52

READY

52P3.2×3.1×0.55mmP=0.4mm

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U585QII6 (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U585QII6

ST(意法半导体)·UFBGA-132(7x7)

READY

132P7.0×7.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U5A5QJI6Q (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U5A5QJI6Q

ST(意法半导体)·UFBGA-132(7x7)

READY

132P7.0×7.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

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