4102 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4104 款元器件 · 第 116/257)

显示 1841–1856 共 4104 款元器件

SMD,26.7x17.8mm · 47P

RN2483A-I/RM105 (SMD,26.7x17.8mm) - 3D模型 (SMD,26.7x17.8mm)

RN2483A-I/RM105

MICROCHIP·SMD,26.7x17.8mm

READY

47P26.7×17.8×3.10mmP=1.27mm2.1V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

LFBGA-217 · 217P

AT91SAM9CN12B-CU (LFBGA-217) - 3D模型 (LFBGA-217)

AT91SAM9CN12B-CU

Microchip Technology·LFBGA-217

READY

217P15.0×15.0×1.35mmP=0.8mm

接口转换与时钟定时器芯片

- · 7P

FAN5341UMPX-F106 (-) - 3D模型 (-)

FAN5341UMPX-F106

READY

7P2.0×2.0×0.85mmP=0.65mm2.7 V to 5.5 V

标准电子与连接器元件

MQFP-128(14x20) · 128P

SCH5127-NW (MQFP-128(14x20)) - 3D模型 (MQFP-128(14x20))

SCH5127-NW

MICROCHIP·MQFP-128(14x20)

READY

128P20.0×14.0×1.60mmP=0.5mm

标准电子与连接器元件

SMD3225-6P · 6P

SWPM201DCAIAB-200.000000 (SMD3225-6P) - 3D模型 (SMD3225-6P)

SWPM201DCAIAB-200.000000

Starwave(思大)·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

CPGA-28(14x16.5) · 28P

AT28C256-25UM/883-815 (CPGA-28(14x16.5)) - 3D模型 (CPGA-28(14x16.5))

AT28C256-25UM/883-815

MICROCHIP·CPGA-28(14x16.5)

READY

28P15.2×13.7×3.68mm

标准电子与连接器元件

DFN-8-EP(2x3) · 9P

24AA01T-I/MC (DFN-8-EP(2x3)) - 3D模型 (DFN-8-EP(2x3))

24AA01T-I/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.7V-5.5V

标准电子与连接器元件

QFN-12(2x2) · 12P

TLV62585RWTT (QFN-12(2x2)) - 3D模型 (QFN-12(2x2))

TLV62585RWTT

TI·QFN-12(2x2)

READY

12P2.0×2.0×0.90mmP=0.5mm2.5 V to 5.5 V

标准电子与连接器元件

SMD1612-4P · 4P

DSC6121HI2A-00APT (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6121HI2A-00APT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

SMD1612-4P · 4P

DSC6023HI2A-00A9 (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6023HI2A-00A9

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

QFN-64(7x7) · 65P

ATMEGA169PV-8MCHR (QFN-64(7x7)) - 3D模型 (QFN-64(7x7))

ATMEGA169PV-8MCHR

MICROCHIP·QFN-64(7x7)

READY

65P7.0×7.0×1.35mmP=0.65mm1.8V - 5.5V

嵌入式微控制器芯片 (MCU)

- · 37P

ATWINC3400-MR210UA (-) - 3D模型 (-)

ATWINC3400-MR210UA

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD3225-6P · 6P

DSC1121CI2-125.0000 (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC1121CI2-125.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

SMD3225-6P · 6P

DSC1121CI2-020.0000 (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC1121CI2-020.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

SMD1612-4P · 4P

AMPMGGC-4.0960T (SMD1612-4P) - 3D模型 (SMD1612-4P)

AMPMGGC-4.0960T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

标准电子与连接器元件

- · 37P

RN1810-I/RM110 (-) - 3D模型 (-)

RN1810-I/RM110

READY

37P26.7×17.8×3.10mmP=1.27mm3.15V to 3.45V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

探索器件库封装厂商上传