2284 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3580 款元器件 · 第 116/224)

显示 1841–1856 共 3580 款元器件

LQFP-144(20x20) · 144P

STM32F469ZIT6 (LQFP-144(20x20)) - 3D模型 (LQFP-144(20x20))

STM32F469ZIT6

ST·LQFP-144(20x20)

READY

144P20.0×20.0×1.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-48(7x7) · 49P

STM32F411CCU7 (UFQFPN-48(7x7)) - 3D模型 (UFQFPN-48(7x7))

STM32F411CCU7

ST·UFQFPN-48(7x7)

READY

49P7.0×7.0×0.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-64(10x10) · 64P

STM32G0B1RBT6 (LQFP-64(10x10)) - 3D模型 (LQFP-64(10x10))

STM32G0B1RBT6

ST·LQFP-64(10x10)

READY

64P10.0×10.0×1.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-48(7x7) · 48P

STM32G0B0CET6 (LQFP-48(7x7)) - 3D模型 (LQFP-48(7x7))

STM32G0B0CET6

ST·LQFP-48(7x7)

READY

48P7.0×7.0×1.40mmP=0.5mm

嵌入式微控制器芯片 (MCU)

LQFP-100(14x14) · 100P

STM32F417VGT6 (LQFP-100(14x14)) - 3D模型 (LQFP-100(14x14))

STM32F417VGT6

ST·LQFP-100(14x14)

READY

100P14.0×14.0×1.60mmP=0.5mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TSSOP-20 · 20P

STM32C011F4P6 (TSSOP-20) - 3D模型 (TSSOP-20)

STM32C011F4P6

READY

20P6.5×4.4×1.20mmP=0.65mm2.0 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFN-28 · 28P

STM32L011G4U6TR (UFQFN-28) - 3D模型 (UFQFN-28)

STM32L011G4U6TR

READY

28P4.0×4.0×0.85mmP=0.5mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-32(5x5) · 33P

STM32L432KBU6TR (UFQFPN-32(5x5)) - 3D模型 (UFQFPN-32(5x5))

STM32L432KBU6TR

ST·UFQFPN-32(5x5)

READY

33P5.0×5.0×0.55mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-100(14x14) · 100P

STM32F750V8T6 (LQFP-100(14x14)) - 3D模型 (LQFP-100(14x14))

STM32F750V8T6

ST·LQFP-100(14x14)

READY

100P14.0×14.0×1.60mmP=0.5mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

LQFP-176(24x24) · 176P

STM32F207IGT6 (LQFP-176(24x24)) - 3D模型 (LQFP-176(24x24))

STM32F207IGT6

ST·LQFP-176(24x24)

READY

176P24.0×24.0×1.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

LQFP-80(12x12) · 80P

STM32U083MCT6 (LQFP-80(12x12)) - 3D模型 (LQFP-80(12x12))

STM32U083MCT6

ST·LQFP-80(12x12)

READY

80P12.0×12.0×1.60mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

VFQFPN-32-EP(5x5) · 33P

STM32WL33KCV6 (VFQFPN-32-EP(5x5)) - 3D模型 (VFQFPN-32-EP(5x5))

STM32WL33KCV6

ST·VFQFPN-32-EP(5x5)

READY

33P5.0×5.0×0.85mmP=0.5mm

嵌入式微控制器芯片 (MCU)

WLCSP-49(3.1x3.1) · 49P

STM32L431CBY7TR (WLCSP-49(3.1x3.1)) - 3D模型 (WLCSP-49(3.1x3.1))

STM32L431CBY7TR

ST·WLCSP-49(3.1x3.1)

READY

49P3.1×3.1×0.56mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-100 · 100P

STM32G473VEH6 (TFBGA-100) - 3D模型 (TFBGA-100)

STM32G473VEH6

READY

100P8.0×8.0×1.10mmP=0.8mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TSSOP-20(4.4x6.5) · 20P

STM32F042F6P7 (TSSOP-20(4.4x6.5)) - 3D模型 (TSSOP-20(4.4x6.5))

STM32F042F6P7

ST·TSSOP-20(4.4x6.5)

READY

20P6.5×4.4×1.20mmP=0.65mm2 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFQFPN-28(4x4) · 28P

STM32G051G8U6 (UFQFPN-28(4x4)) - 3D模型 (UFQFPN-28(4x4))

STM32G051G8U6

ST·UFQFPN-28(4x4)

READY

28P4.0×4.0×0.55mmP=0.5mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

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