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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4104 款元器件 · 第 107/257)

显示 1697–1712 共 4104 款元器件

SMD-36P · 37P

ATWINC3400-MR210UA142 (SMD-36P) - 3D模型 (SMD-36P)

ATWINC3400-MR210UA142

MICROCHIP·SMD-36P

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD-28P · 29P

ATWINC1510-MR210PB1976 (SMD-28P) - 3D模型 (SMD-28P)

ATWINC1510-MR210PB1976

MICROCHIP·SMD-28P

READY

29P21.8×14.8×2.40mmP=1.02mm2.7V to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

UFBGA-88(6x6) · 88P

ATMXT640UD-CCUBHA1 (UFBGA-88(6x6)) - 3D模型 (UFBGA-88(6x6))

ATMXT640UD-CCUBHA1

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

标准电子与连接器元件

WFBGA-84 · 84P

EEC1005-I/SX1-UB1 (WFBGA-84) - 3D模型 (WFBGA-84)

EEC1005-I/SX1-UB1

MICROCHIP·WFBGA-84

READY

84P7.0×7.0×1.35mmP=0.65mm

标准电子与连接器元件

UFBGA-162(5x10) · 162P

ATMXT2952TD-C2UR001 (UFBGA-162(5x10)) - 3D模型 (UFBGA-162(5x10))

ATMXT2952TD-C2UR001

MICROCHIP·UFBGA-162(5x10)

READY

162P5.0×10.0×0.60mmP=0.5mm1.8V to 3.3V

标准电子与连接器元件

- · 59P

ATSAMW25H18-MR210PB1952 (-) - 3D模型 (-)

ATSAMW25H18-MR210PB1952

READY

59P30.8×14.2×2.40mmP=1.2mm2.7 to 3.6V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

WFBGA-48(4x6) · 48P

SST39WF400B-70-4C-MAQE-T (WFBGA-48(4x6)) - 3D模型 (WFBGA-48(4x6))

SST39WF400B-70-4C-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

WFBGA-48(4x6) · 48P

SST39WF400B-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D模型 (WFBGA-48(4x6))

SST39WF400B-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

WFBGA-48(4x6) · 48P

SST39VF1602C-70-4C-MAQE (WFBGA-48(4x6)) - 3D模型 (WFBGA-48(4x6))

SST39VF1602C-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

WFBGA-48(4x6) · 48P

SST39VF802C-70-4C-MAQE (WFBGA-48(4x6)) - 3D模型 (WFBGA-48(4x6))

SST39VF802C-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

标准电子与连接器元件

SMD1612-4P · 4P

DSC6023HI2A-00AAT (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6023HI2A-00AAT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C2650836 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D模型 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C2650836

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

标准电子与连接器元件

SMD1612-4P · 4P

DSC6003HE1A-000.0000T (SMD1612-4P) - 3D模型 (SMD1612-4P)

DSC6003HE1A-000.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

标准电子与连接器元件

QFN-44(5x5) · 45P

ATMEGA164PA-MCH (QFN-44(5x5)) - 3D模型 (QFN-44(5x5))

ATMEGA164PA-MCH

MICROCHIP·QFN-44(5x5)

READY

45P5.0×5.0×1.35mmP=0.53mm1.8V to 5.5V

嵌入式微控制器芯片 (MCU)

- · 162P

ATMXT2952T2-C2U (-) - 3D模型 (-)

ATMXT2952T2-C2U

READY

162P5.0×10.0×0.58mmP=0.5mm

标准电子与连接器元件

SMD3225-6P · 6P

DSC8101CI2-PROGRAMMABLE (SMD3225-6P) - 3D模型 (SMD3225-6P)

DSC8101CI2-PROGRAMMABLE

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

标准电子与连接器元件

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