4086 부품PDF 업로드

전체 패키지 RF 모듈 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

부품 카탈로그 (4104 개 부품 중 · 페이지 256/257)

표시 중 4081–4096 전체 4104 개 부품 중

SOT-223 · 4P

AMS1117-3.3 (SOT-223) - 3D 모델 (SOT-223)

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

저전압 강하 선형 레귤레이터 (LDO)

0805 · 2P

0805W8F1004T5E (0805) - 3D 모델 (0805)

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

표준 전자 부품 및 커넥터

LQFN-56(7x7) · 57P

RP2040 (LQFN-56(7x7)) - 3D 모델 (LQFN-56(7x7))

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

임베디드 마이크로컨트롤러 (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D 모델 (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi / Bluetooth LE 무선 SoC 모듈

DIP-8 · 8P

NE555P (DIP-8) - 3D 모델 (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

인터페이스 브리지 및 클럭/타이머 IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D 모델 (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

임베디드 마이크로컨트롤러 (MCU)

SOIC-20-300mil · 8P

PIC16F1829T-I/SO (SOIC-20-300mil) - 3D 모델 (SOIC-20-300mil)

PIC16F1829T-I/SO

MICROCHIP(美国微芯)·SOIC-20-300mil

READY

8P

8/14/20引脚，8位闪存微控制器

SSOP-20-208mil · 8P

PIC16F1709T-I/SS (SSOP-20-208mil) - 3D 모델 (SSOP-20-208mil)

PIC16F1709T-I/SS

MICROCHIP(美国微芯)·SSOP-20-208mil

READY

8P

PIC16F1709T-I/SS

SOIC-28-300mil · 8P

PIC18F25K50T-I/SO (SOIC-28-300mil) - 3D 모델 (SOIC-28-300mil)

PIC18F25K50T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18F25K50T-I/SO

SOIC-28-300mil · 8P

PIC18F258T-I/SO (SOIC-28-300mil) - 3D 모델 (SOIC-28-300mil)

PIC18F258T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18F258T-I/SO

SOIC-28-300mil · 8P

PIC18F2458T-I/SO (SOIC-28-300mil) - 3D 모델 (SOIC-28-300mil)

PIC18F2458T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC18F2458T-I/SO

QFN-44-EP(8x8) · 8P

PIC18F45K40T-I/ML (QFN-44-EP(8x8)) - 3D 모델 (QFN-44-EP(8x8))

PIC18F45K40T-I/ML

MICROCHIP(美国微芯)·QFN-44-EP(8x8)

READY

8P

PIC18F45K40T-I/ML

SOIC-20-300mil · 8P

PIC18F14K50T-I/SO (SOIC-20-300mil) - 3D 모델 (SOIC-20-300mil)

PIC18F14K50T-I/SO

MICROCHIP(美国微芯)·SOIC-20-300mil

READY

8P

PIC18F14K50T-I/SO

MSOP-8 · 8P

MCP6292-H/MS (MSOP-8) - 3D 모델 (MSOP-8)

MCP6292-H/MS

MICROCHIP(美国微芯)·MSOP-8

READY

8P

MCP6292 H/MS

VQFN-100-EP(12x12) · 8P

USB7051T-I/KDX (VQFN-100-EP(12x12)) - 3D 모델 (VQFN-100-EP(12x12))

USB7051T-I/KDX

MICROCHIP(美国微芯)·VQFN-100-EP(12x12)

READY

8P

USB7051T-I/KDX

MSOP-8 · 8P

MIC5219-2.5YMM-TR (MSOP-8) - 3D 모델 (MSOP-8)

MIC5219-2.5YMM-TR

MICROCHIP(美国微芯)·MSOP-8

READY

8P

MIC5219-2.5YMM-TR

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