3778 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3784 Bauteilen · Seite 95/237)

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WFBGA-100 · 100P

SCH3226-SY (WFBGA-100) - 3D-Modell (WFBGA-100)

SCH3226-SY

MICROCHIP·WFBGA-100

READY

100P8.0×8.0×1.35mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-84 · 100P

SCH3224I-SY (WFBGA-84) - 3D-Modell (WFBGA-84)

SCH3224I-SY

MICROCHIP·WFBGA-84

READY

100P8.0×8.0×1.35mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-672 · 672P

LFE3-35EA-7FN672I (FPBGA-672) - 3D-Modell (FPBGA-672)

LFE3-35EA-7FN672I

Lattice·FPBGA-672

READY

672P27.0×27.0×1.35mmP=1mm5 V to 1.32 V

Standard-Elektronik- & Steckverbinderbauteil

CSP-201 · 201P

AGLP060V2-CSG201I (CSP-201) - 3D-Modell (CSP-201)

AGLP060V2-CSG201I

MICROCHIP·CSP-201

READY

201P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-672(27x27) · 672P

VSC7449YIH-02 (FCBGA-672(27x27)) - 3D-Modell (FCBGA-672(27x27))

VSC7449YIH-02

MICROCHIP·FCBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-64 · 64P

SCH3223-7U-TR (WFBGA-64) - 3D-Modell (WFBGA-64)

SCH3223-7U-TR

MICROCHIP·WFBGA-64

READY

64P6.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ1024EFH144-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFH144-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-BGG272 (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-BGG272

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-672(27x27) · 672P

LFCPNX-100-8LFG672C (FCBGA-672(27x27)) - 3D-Modell (FCBGA-672(27x27))

LFCPNX-100-8LFG672C

Lattice·FCBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6102HI1A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6102HI1A-000.0000T

MICROCHIP(美国微芯)·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C2040989 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C2040989

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SMD,26.7x17.8mm · 47P

RN2483A-I/RM105 (SMD,26.7x17.8mm) - 3D-Modell (SMD,26.7x17.8mm)

RN2483A-I/RM105

MICROCHIP·SMD,26.7x17.8mm

READY

47P26.7×17.8×3.10mmP=1.27mm2.1V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

LFBGA-217 · 217P

AT91SAM9CN12B-CU (LFBGA-217) - 3D-Modell (LFBGA-217)

AT91SAM9CN12B-CU

Microchip Technology·LFBGA-217

READY

217P15.0×15.0×1.35mmP=0.8mm

Schnittstellen-Bridge & Takt-/Timer-IC

- · 7P

FAN5341UMPX-F106 (-) - 3D-Modell (-)

FAN5341UMPX-F106

READY

7P2.0×2.0×0.85mmP=0.65mm2.7 V to 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

MQFP-128(14x20) · 128P

SCH5127-NW (MQFP-128(14x20)) - 3D-Modell (MQFP-128(14x20))

SCH5127-NW

MICROCHIP·MQFP-128(14x20)

READY

128P20.0×14.0×1.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

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