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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128588 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D-Modell (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128588

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFM144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFM144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ0512EFF144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ0512EFF144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618465 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618465

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-196 · 196P

SAM9X60D6K-I/4GB (TFBGA-196) - 3D-Modell (TFBGA-196)

SAM9X60D6K-I/4GB

MICROCHIP·TFBGA-196

READY

196P11.0×11.0×1.20mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C17355649 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C17355649

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-256(27x27) · 272P

OR2T15B8BA256-DB (PBGA-256(27x27)) - 3D-Modell (PBGA-256(27x27))

OR2T15B8BA256-DB

Lattice·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C1340622 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C1340622

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

CSP-201 · 201P

AGLP030V2-CSG201I (CSP-201) - 3D-Modell (CSP-201)

AGLP030V2-CSG201I

MICROCHIP·CSP-201

READY

201P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

Standard-Elektronik- & Steckverbinderbauteil

- · 272P

ISPLSI81080V-60LB272I (-) - 3D-Modell (-)

ISPLSI81080V-60LB272I

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

BGA-272(27x27) · 272P

ISPLSI81080V-60LB272 (BGA-272(27x27)) - 3D-Modell (BGA-272(27x27))

ISPLSI81080V-60LB272

Lattice·BGA-272(27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

LBGA-208(17x17) · 208P

ZL50232GDG2 (LBGA-208(17x17)) - 3D-Modell (LBGA-208(17x17))

ZL50232GDG2

MICROCHIP·LBGA-208(17x17)

READY

208P17.0×17.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-552(35x35) · 552P

ZL50110GAG2 (PBGA-552(35x35)) - 3D-Modell (PBGA-552(35x35))

ZL50110GAG2

MICROCHIP·PBGA-552(35x35)

READY

552P35.0×35.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

BGA-247 · 247P

AT91SAM9CN12B-CFUR (BGA-247) - 3D-Modell (BGA-247)

AT91SAM9CN12B-CFUR

MICROCHIP·BGA-247

READY

247P10.0×10.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1123CE1-150.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1123CE1-150.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1122CI2-156.2500 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1122CI2-156.2500

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

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