3752 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3756 Bauteilen · Seite 74/235)

Zeige 1169–1184 von 3756 Bauteilen

WFBGA-48(4x6) · 48P

SST39VF801C-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39VF801C-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF1601-70-4C-MAQE (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF1601-70-4C-MAQE

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48(4x6) · 48P

SST39WF1602-70-4I-MAQE-T (WFBGA-48(4x6)) - 3D-Modell (WFBGA-48(4x6))

SST39WF1602-70-4I-MAQE-T

MICROCHIP·WFBGA-48(4x6)

READY

48P4.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

DSC1123CI2-100.0000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

DSC1123CI2-100.0000

MICROCHIP·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm2.25V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD-35P · 36P

RN41-I/RM (SMD-35P) - 3D-Modell (SMD-35P)

RN41-I/RM

MICROCHIP·SMD-35P

READY

36P25.8×13.2×2.40mmP=1mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD1612-4P · 4P

DSC6013HI2A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6013HI2A-000.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-64 · 64P

SCH3221I-7U (WFBGA-64) - 3D-Modell (WFBGA-64)

SCH3221I-7U

MICROCHIP·WFBGA-64

READY

64P6.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-84 · 64P

SCH3223I-7U (WFBGA-84) - 3D-Modell (WFBGA-84)

SCH3223I-7U

MICROCHIP·WFBGA-84

READY

64P6.0×6.0×1.35mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6121HI2A-00AG (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6121HI2A-00AG

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6023HI2A-00AD (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6023HI2A-00AD

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

BGA-42(5.3x5.3) · 42P

HV2605BD-M936 (BGA-42(5.3x5.3)) - 3D-Modell (BGA-42(5.3x5.3))

HV2605BD-M936

MICROCHIP·BGA-42(5.3x5.3)

READY

42P5.3×5.3×0.55mmP=0.6mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-206 · 206P

HV7322-V/AGA (TFBGA-206) - 3D-Modell (TFBGA-206)

HV7322-V/AGA

MICROCHIP·TFBGA-206

READY

206P12.0×12.0×1.20mmP=0.65mm10V -10V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-196_L11.0-W11.0-P0.65-TL_MICROCHIP_SAM9X60 · 196P

C633939 (TFBGA-196_L11.0-W11.0-P0.65-TL_MICROCHIP_SAM9X60) - 3D-Modell (TFBGA-196_L11.0-W11.0-P0.65-TL_MICROCHIP_SAM9X60)

C633939

Generic·TFBGA-196_L11.0-W11.0-P0.65-TL_MICROCHIP_SAM9X60

READY

196P11.0×11.0×1.12mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

LFBGA-144 · 144P

CY9BF466RBGL-GK7E1 (LFBGA-144) - 3D-Modell (LFBGA-144)

CY9BF466RBGL-GK7E1

Infineon/CYPRESS·LFBGA-144

READY

144P7.0×7.0×1.30mmP=0.5mm2.7 V to 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-105(9x9) · 105P

HV53001T-E/KWX (TFBGA-105(9x9)) - 3D-Modell (TFBGA-105(9x9))

HV53001T-E/KWX

MICROCHIP·TFBGA-105(9x9)

READY

105P9.0×9.0×1.20mmP=0.65mm2.7V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6112HE2A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6112HE2A-000.0000T

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

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