3677 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3687 Bauteilen · Seite 66/231)

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FPBGA-484(27x27) · 484P

A54SX32A-2FGG484 (FPBGA-484(27x27)) - 3D-Modell (FPBGA-484(27x27))

A54SX32A-2FGG484

MICROCHIP·FPBGA-484(27x27)

READY

484P27.0×27.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-329 · 329P

A54SX32A-FBG329 (PBGA-329) - 3D-Modell (PBGA-329)

A54SX32A-FBG329

MICROCHIP·PBGA-329

READY

329P31.0×31.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(17x17) · 256P

M1AFS1500-FGG256 (FPBGA-256(17x17)) - 3D-Modell (FPBGA-256(17x17))

M1AFS1500-FGG256

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard-Elektronik- & Steckverbinderbauteil

VFBGA-400 · 400P

M2GL060-1VF400I (VFBGA-400) - 3D-Modell (VFBGA-400)

M2GL060-1VF400I

MICROCHIP·VFBGA-400

READY

400P17.0×17.0×0.85mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256 · 256P

P1AFS600-2FGG256I (FPBGA-256) - 3D-Modell (FPBGA-256)

P1AFS600-2FGG256I

MICROCHIP·FPBGA-256

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256 · 256P

M1AFS250-1FGG256I (FPBGA-256) - 3D-Modell (FPBGA-256)

M1AFS250-1FGG256I

MICROCHIP·FPBGA-256

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT25020AN-10SU-2.7 (SOIC-8) - 3D-Modell (SOIC-8)

AT25020AN-10SU-2.7

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

AT24C04-10PC-2.7 (DIP-8) - 3D-Modell (DIP-8)

AT24C04-10PC-2.7

MICROCHIP·DIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

AT24C16B-TH-B (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24C16B-TH-B

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

AT25040A-10PU-2.7 (PDIP-8) - 3D-Modell (PDIP-8)

AT25040A-10PU-2.7

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(9x9) · 65P

DSPIC33CK128MC506-E/MR (QFN-64(9x9)) - 3D-Modell (QFN-64(9x9))

DSPIC33CK128MC506-E/MR

MICROCHIP·QFN-64(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

24FC16HT-I/OT (SOT-23-5) - 3D-Modell (SOT-23-5)

24FC16HT-I/OT

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm1.7V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL · 32P

C19483404 (TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL) - 3D-Modell (TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL)

C19483404

Generic·TSOP-32_L8.1-W12.5-P0.50-LS14.2-TL

READY

32P8.1×12.5×2.45mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

SY100EL16VBZG-TR (SOIC-8) - 3D-Modell (SOIC-8)

SY100EL16VBZG-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

MIC37302WU-TR (TO-263-5) - 3D-Modell (TO-263-5)

MIC37302WU-TR

MICROCHIP·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm3.0V to 2.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(4x4) · 29P

PIC16F15356T-I/MV (QFN-28-EP(4x4)) - 3D-Modell (QFN-28-EP(4x4))

PIC16F15356T-I/MV

MICROCHIP·QFN-28-EP(4x4)

READY

29P4.0×4.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

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